skip to main content
Language:
Search Limited to: Search Limited to: Resource type Show Results with: Show Results with: Search type Index

Results 1 - 20 of 1,730  for All Library Resources

Sorted by: Sorted by: RelevanceOr hit Enter to replace sort method
Results 1 2 3 4 5 next page
Show only
Result Number Material Type Add to My Shelf Action Record Details and Options
1
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Material Type:
Book 		Add to My Research

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

ISBN: 0470827807 ;ISBN: 9780470827802 ;ISBN: 9780470827819 ;ISBN: 0470827815 ;ISBN: 0470827823 ;ISBN: 9780470827826 ;EISBN: 9780470827819 ;EISBN: 0470827815 ;EISBN: 0470828412 ;EISBN: 9780470828410 ;DOI: 10.1002/9780470827826 ;OCLC: 756280855 ;LCCallNum: TK7870.15

Full text available

Citations Cited by
2
Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications
Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications
Material Type:
Article 		Add to My Research

Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications

Journal of electronic materials, 2020, Vol.49 (1), p.212-225 [Peer Reviewed Journal]

The Minerals, Metals & Materials Society 2019 ;Journal of Electronic Materials is a copyright of Springer, (2019). All Rights Reserved. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-019-07681-x

Full text available

Citations Cited by
3
Hybrid Solder Joint for Low-Temperature Bonding Application
Hybrid Solder Joint for Low-Temperature Bonding Application
Material Type:
Article 		Add to My Research

Hybrid Solder Joint for Low-Temperature Bonding Application

Journal of electronic materials, 2023-02, Vol.52 (2), p.782-791 [Peer Reviewed Journal]

The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10111-0

Full text available

Citations Cited by
4
Rapid Flow Behavior Modeling of Thermal Interface Materials Using Deep Neural Networks
Rapid Flow Behavior Modeling of Thermal Interface Materials Using Deep Neural Networks
Material Type:
Article 		Add to My Research

Rapid Flow Behavior Modeling of Thermal Interface Materials Using Deep Neural Networks

IEEE access, 2024, Vol.12, p.17782-17792 [Peer Reviewed Journal]

Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024 ;ISSN: 2169-3536 ;EISSN: 2169-3536 ;DOI: 10.1109/ACCESS.2024.3359169 ;CODEN: IAECCG

Full text available

Citations Cited by
5
Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Material Type:
Book 		Add to My Research

Advanced Materials for Thermal Management of Electronic Packaging

Springer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360

Full text available

Citations Cited by
6
Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging
Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging
Material Type:
Article 		Add to My Research

Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging

IEEE transactions on magnetics, 2023-11, p.1-1

ISSN: 0018-9464 ;EISSN: 1941-0069 ;DOI: 10.1109/TMAG.2023.3286208 ;CODEN: IEMGAQ

Digital Resources/Online E-Resources

Citations Cited by
7
Low-voltage 2D materials-based printed field-effect transistors for integrated digital and analog electronics on paper
Low-voltage 2D materials-based printed field-effect transistors for integrated digital and analog electronics on paper
Material Type:
Article 		Add to My Research

Low-voltage 2D materials-based printed field-effect transistors for integrated digital and analog electronics on paper

Nature communications, 2020-07, Vol.11 (1), p.3566-3566, Article 3566 [Peer Reviewed Journal]

The Author(s) 2020. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2020 ;ISSN: 2041-1723 ;EISSN: 2041-1723 ;DOI: 10.1038/s41467-020-17297-z ;PMID: 32678084

Full text available

Citations Cited by
8
Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Material Type:
Article 		Add to My Research

Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Nature communications, 2021-02, Vol.12 (1), p.1284-1284, Article 1284 [Peer Reviewed Journal]

The Author(s) 2021. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2021 ;ISSN: 2041-1723 ;EISSN: 2041-1723 ;DOI: 10.1038/s41467-021-21531-7 ;PMID: 33627644

Full text available

Citations Cited by
9
Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
Material Type:
Article 		Add to My Research

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

Journal of electronic materials, 2024-03, Vol.53 (3), p.1192-1200 [Peer Reviewed Journal]

The Author(s) 2023 ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-023-10853-5

Digital Resources/Online E-Resources

Citations Cited by
10
Nanopolystyrene translocation and fetal deposition after acute lung exposure during late-stage pregnancy
Nanopolystyrene translocation and fetal deposition after acute lung exposure during late-stage pregnancy
Material Type:
Article 		Add to My Research

Nanopolystyrene translocation and fetal deposition after acute lung exposure during late-stage pregnancy

Particle and fibre toxicology, 2020-10, Vol.17 (1), p.1-11, Article 55 [Peer Reviewed Journal]

COPYRIGHT 2020 BioMed Central Ltd. ;2020. This work is licensed under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2020 ;ISSN: 1743-8977 ;EISSN: 1743-8977 ;DOI: 10.1186/s12989-020-00385-9 ;PMID: 33099312

Full text available

Citations Cited by
11
Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests
Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests
Material Type:
Article 		Add to My Research

Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests

Journal of electronic materials, 2021-12, Vol.50 (12), p.6597-6606 [Peer Reviewed Journal]

The Minerals, Metals & Materials Society 2021 ;The Minerals, Metals & Materials Society 2021. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-021-09221-y

Full text available

Citations Cited by
12
Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C
Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C
Material Type:
Article 		Add to My Research

Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C

Power electronic devices and components, 2022-10, Vol.3, p.100014, Article 100014 [Peer Reviewed Journal]

2022 ;ISSN: 2772-3704 ;EISSN: 2772-3704 ;DOI: 10.1016/j.pedc.2022.100014

Full text available

Citations Cited by
13
A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readout
A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readout
Material Type:
Article 		Add to My Research

A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readout

Applied physics letters, 2015-05, Vol.106 (19) [Peer Reviewed Journal]

2015 AIP Publishing LLC. ;ISSN: 0003-6951 ;EISSN: 1077-3118 ;DOI: 10.1063/1.4921318

Full text available

Citations Cited by
14
The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing
The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing
Material Type:
Article 		Add to My Research

The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing

Journal of electronic materials, 2023-02, Vol.52 (2), p.751-759 [Peer Reviewed Journal]

The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10086-y

Full text available

Citations Cited by
15
Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
Material Type:
Article 		Add to My Research

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Journal of materials science, 2019-01, Vol.54 (2), p.1741-1768 [Peer Reviewed Journal]

Springer Science+Business Media, LLC, part of Springer Nature 2018 ;COPYRIGHT 2019 Springer ;Copyright Springer Science & Business Media 2019 ;Journal of Materials Science is a copyright of Springer, (2018). All Rights Reserved. ;ISSN: 0022-2461 ;EISSN: 1573-4803 ;DOI: 10.1007/s10853-018-2907-y

Full text available

Citations Cited by
16
Terahertz Imaging and Sensing Applications With Silicon-Based Technologies
Terahertz Imaging and Sensing Applications With Silicon-Based Technologies
Material Type:
Article 		Add to My Research

Terahertz Imaging and Sensing Applications With Silicon-Based Technologies

IEEE transactions on terahertz science and technology, 2019-01, Vol.9 (1), p.1-19 [Peer Reviewed Journal]

ISSN: 2156-342X ;EISSN: 2156-3446 ;DOI: 10.1109/TTHZ.2018.2884852 ;CODEN: ITTSBX

Digital Resources/Online E-Resources

Citations Cited by
17
Design and fabrication of micro and nano surface structures for enhancing metal–polymer adhesion using femtosecond laser treatment
Design and fabrication of micro and nano surface structures for enhancing metal–polymer adhesion using femtosecond laser treatment
Material Type:
Article 		Add to My Research

Design and fabrication of micro and nano surface structures for enhancing metal–polymer adhesion using femtosecond laser treatment

Materials & design, 2022-12, Vol.224, p.111349, Article 111349 [Peer Reviewed Journal]

2022 The Author(s) ;ISSN: 0264-1275 ;EISSN: 1873-4197 ;DOI: 10.1016/j.matdes.2022.111349

Full text available

Citations Cited by
18
Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic Devices
Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic Devices
Material Type:
Article 		Add to My Research

Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic Devices

Journal of electronic materials, 2023-02, Vol.52 (2), p.792-800 [Peer Reviewed Journal]

The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10118-7

Full text available

Citations Cited by
19
Study on thermal conductivity of micron BN-nano SiO2 combined modified epoxy resin composites
Study on thermal conductivity of micron BN-nano SiO2 combined modified epoxy resin composites
Material Type:
Conference Proceeding 		Add to My Research

Study on thermal conductivity of micron BN-nano SiO2 combined modified epoxy resin composites

Journal of physics. Conference series, 2024, Vol.2720 (1), p.012009 [Peer Reviewed Journal]

Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2720/1/012009

Full text available

Citations Cited by
20
Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints
Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints
Material Type:
Article 		Add to My Research

Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints

Journal of electronic materials, 2023-02, Vol.52 (2), p.739-750 [Peer Reviewed Journal]

The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10065-3

Full text available

Citations Cited by

Results 1 - 20 of 1,730  for All Library Resources

Sorted by: Sorted by: RelevanceOr hit Enter to replace sort method
Results 1 2 3 4 5 next page

Personalize your results

  1. Edit

Refine Search Results

Expand My Results

  1.   

Show only

  1. Peer-reviewed Journals (1,229)

Refine My Results

Creation Date 

From To
Refine
  1. Before 1988  (11)
  2. 1988 To 1996  (66)
  3. 1997 To 2005  (222)
  4. 2006 To 2015  (382)
  5. After 2015  (1,077)
  6. More options open sub menu

Language 

  1. English  (1,713)
  2. Japanese  (111)
  3. German  (14)
  4. Chinese  (9)
  5. French  (4)
  6. Korean  (2)
  7. Latvian  (1)
  8. Catalan  (1)
  9. Portuguese  (1)
  10. More options open sub menu
INSPIRE LIBRARY - TON DUC THANG UNIVERSITY (84-028) 37 755 057 Feedback
19 Nguyen Huu Tho St. Dist.7, HCM thuvien@tdtu.edu.vn

Copyright © 2017 INSPIRE LIBRARY - TON DUC THANG UNIVERSITY

Searching Remote Databases, Please Wait