10 Results for All Library Resources
Sorted by:
Sorted by:
RelevanceOr hit Enter to replace sort method
- Relevance
- Date-newest
- Date-oldest
- Popularity
- Author
- Title
Show only
Refined by:
creation date:
Before 1988
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Book
|
|
Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium Sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, Held at Boulder, Colorado, August 19-21 1964Springer Science+Business Media New York 1965 ;ISBN: 1489972951 ;ISBN: 9781489972958 ;ISBN: 1489973087 ;ISBN: 9781489973085 ;EISBN: 1489973079 ;EISBN: 9781489973078 ;DOI: 10.1007/978-1-4899-7307-8 ;OCLC: 1266906387Full text available |
| 2 |
Material Type: Book
|
|
Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, Sponsored by the University of Colorado and EDN (Electrical Design News), Held at Boulder, ColoradoSpringer Science+Business Media New York 1962 ;ISBN: 9781489972972 ;ISBN: 1489972978 ;ISBN: 9781489973122 ;ISBN: 1489973125 ;EISBN: 9781489973115 ;EISBN: 1489973117 ;DOI: 10.1007/978-1-4899-7311-5 ;OCLC: 1263872418Full text available |
| 3 |
Material Type: Book
|
|
Advances in Electronic Circuit Packaging: Volume 3Springer Science+Business Media New York 1963 ;ISBN: 9781489972965 ;ISBN: 148997296X ;ISBN: 9781489973108 ;ISBN: 1489973109 ;EISBN: 9781489973092 ;EISBN: 1489973095 ;DOI: 10.1007/978-1-4899-7309-2 ;OCLC: 1256691480Full text available |
| 4 |
Material Type: Thesises (postgraduate)
|
|
Analysis and testing of the thermal design of the electrical package in the U.S. Army's Upgraded Logic Module (ULM)This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.Digital Resources/Online E-Resources |
| 5 |
Material Type: Reports
|
|
Properties of Polystyrene Bead Foam as an Encapsulant for Electronic PackagesAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 6 |
Material Type: Reports
|
|
|
| 7 |
Material Type: Article
|
|
Software Reuse through Building BlocksIEEE software, 1987-07, Vol.4 (4), p.34-42 [Peer Reviewed Journal]Copyright IEEE Computer Society Jul/Aug 1987 ;ISSN: 0740-7459 ;EISSN: 1937-4194 ;DOI: 10.1109/MS.1987.231062 ;CODEN: IESOEGFull text available |
| 8 |
Material Type: Article
|
|
VIPS: A Visual DebuggerIEEE software, 1987-05, Vol.4 (3), p.8-19 [Peer Reviewed Journal]Copyright IEEE Computer Society May/Jun 1987 ;ISSN: 0740-7459 ;EISSN: 1937-4194 ;DOI: 10.1109/MS.1987.230394 ;CODEN: IESOEGFull text available |
| 9 |
Material Type: Article
|
|
Phase characterization and dielectric properties of a copper-cordierite electronic packaging systemJournal of electronic materials, 1987-11, Vol.16 (6), p.423-426 [Peer Reviewed Journal]1988 INIST-CNRS ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/BF02655496 ;CODEN: JECMA5Full text available |
| 10 |
Material Type: Article
|
|
Cadmium telluride detector development and use in reentry vehicle applicationsRevue de physique appliquée, 1977-01, Vol.12 (2), p.385-389Distributed under a Creative Commons Attribution 4.0 International License ;ISSN: 0035-1687 ;EISSN: 2777-3671 ;DOI: 10.1051/rphysap:01977001202038500Full text available |
Personalize your results
Refine Search Results
Expand My Results
Show only
Refine My Results
Creation Date
- Before 1962 (1)
- 1962 To 1962 (1)
- 1963 To 1964 (1)
- 1965 To 1968 (2)
- After 1968 (6)
-
More options
Resource Type
- Articles (4)
- Books (3)
- Reports (2)
- Thesises (postgraduate) (1)
-
More options
Subject
- Physics (5)
- Electronics (4)
- Science & Technology (4)
- Electronic Packaging (3)
- Electronic Circuits And Devices (3)
- Microelectronics (3)
- Electronics And Microelectronics, Instrumentation (3)
- Technology (3)
- Electronic Packaging-Congresses (3)
- Electronic Circuits (3)
- Physics And Astronomy (3)
- Computer Science, Software Engineering (2)
- Computer Science (2)
- Physical Sciences (2)
- Electronics Packaging (2)
- Electronic Equipment (2)
- Packaging (2)
- Laboratories (2)
- Containers And Packaging (2)
- Encapsulation (2)
-
More options
Databases
Journal Title
|
||||
 |
INSPIRE LIBRARY - TON DUC THANG UNIVERSITY |  |
(84-028) 37 755 057 | Feedback |
| 19 Nguyen Huu Tho St. Dist.7, HCM |  |
thuvien@tdtu.edu.vn | ||