Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Web Resources
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Simulation-based investigation of interface delamination in plastic IC packages under temperature and moisture loadingDigital Resources/Online E-Resources |
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2 |
Material Type: Web Resources
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Template-Assisted Electrodeposition of Metallic Nanowires and their Application in Electronic PackagingDigital Resources/Online E-Resources |
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3 |
Material Type: Web Resources
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Metallization of CVD diamond using metal oxide intermediate layers for electronics packagingDigital Resources/Online E-Resources |
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4 |
Material Type: Web Resources
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Advanced RF frontend technology using micromachined SiGe (ARTEMIS) :Public Final ReportDigital Resources/Online E-Resources |