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1
Simulation-based investigation of interface delamination in plastic IC packages under temperature and moisture loading
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Simulation-based investigation of interface delamination in plastic IC packages under temperature and moisture loading

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2
Template-Assisted Electrodeposition of Metallic Nanowires and their Application in Electronic Packaging
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Template-Assisted Electrodeposition of Metallic Nanowires and their Application in Electronic Packaging

Digital Resources/Online E-Resources

3
Metallization of CVD diamond using metal oxide intermediate layers for electronics packaging
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Metallization of CVD diamond using metal oxide intermediate layers for electronics packaging

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4
Advanced RF frontend technology using micromachined SiGe (ARTEMIS) :Public Final Report
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Advanced RF frontend technology using micromachined SiGe (ARTEMIS) :Public Final Report

Digital Resources/Online E-Resources

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