Results 1 - 20 of 318 for All Library Resources
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2006 To 2015
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Book
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and TestingISBN: 0470827807 ;ISBN: 9780470827802 ;ISBN: 9780470827819 ;ISBN: 0470827815 ;ISBN: 0470827823 ;ISBN: 9780470827826 ;EISBN: 9780470827819 ;EISBN: 0470827815 ;EISBN: 0470828412 ;EISBN: 9780470828410 ;DOI: 10.1002/9780470827826 ;OCLC: 756280855 ;LCCallNum: TK7870.15Full text available |
| 2 |
Material Type: Book
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Advanced Materials for Thermal Management of Electronic PackagingSpringer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360Full text available |
| 3 |
Material Type: Article
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A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readoutApplied physics letters, 2015-05, Vol.106 (19) [Peer Reviewed Journal]ISSN: 0003-6951 ;EISSN: 1077-3118 ;DOI: 10.1063/1.4921318Full text available |
| 4 |
Material Type: Book
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Moisture Sensitivity of Plastic Packages of IC DevicesSpringer Science+Business Media, LLC 2010 ;ISBN: 9781441957184 ;ISBN: 1441957189 ;ISBN: 1441957197 ;ISBN: 9781441957191 ;EISBN: 1441957197 ;EISBN: 9781441957191 ;DOI: 10.1007/978-1-4419-5719-1 ;OCLC: 663096136 ;LCCallNum: TK7870.15 .M65 2010ebFull text available |
| 5 |
Material Type: Article
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Three-Dimensional Inkjet-Printed Interconnects using Functional Metallic Nanoparticle InksAdvanced functional materials, 2014-11, Vol.24 (43), p.6834-6842 [Peer Reviewed Journal]2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim ;ISSN: 1616-301X ;EISSN: 1616-3028 ;DOI: 10.1002/adfm.201401312Full text available |
| 6 |
Material Type: Book
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Electronic Equipment Packaging TechnologyISBN: 9780442238186 ;ISBN: 0442238185 ;EISBN: 1461535425 ;EISBN: 9781461535423 ;OCLC: 1066189159Full text available |
| 7 |
Material Type: Book
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Materials for Advanced PackagingSpringer-Verlag US 2009 ;ISBN: 9780387782188 ;ISBN: 0387782184 ;EISBN: 0387782192 ;EISBN: 9780387782195 ;DOI: 10.1007/978-0-387-78219-5 ;OCLC: 426487487Full text available |
| 8 |
Material Type: Article
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A review of mechanical properties of lead-free solders for electronic packagingJournal of materials science, 2009-03, Vol.44 (5), p.1141-1158 [Peer Reviewed Journal]Springer Science+Business Media, LLC 2009 ;Journal of Materials Science is a copyright of Springer, (2009). All Rights Reserved. ;ISSN: 0022-2461 ;EISSN: 1573-4803 ;DOI: 10.1007/s10853-008-3125-9Full text available |
| 9 |
Material Type: Article
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Thermally reversible and self-healing novolac epoxy resins based on Diels-Alder chemistryJournal of applied polymer science, 2015-07, Vol.132 (26), p.np-n/a [Peer Reviewed Journal]2015 Wiley Periodicals, Inc. ;ISSN: 0021-8995 ;EISSN: 1097-4628 ;DOI: 10.1002/app.42167 ;CODEN: JAPNABFull text available |
| 10 |
Material Type: Article
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Review of metal matrix composites with high thermal conductivity for thermal management applicationsProgress in natural science, 2011-06, Vol.21 (3), p.189-197 [Peer Reviewed Journal]2011 Chinese Materials Research Society ;ISSN: 1002-0071 ;DOI: 10.1016/S1002-0071(12)60029-XFull text available |
| 11 |
Material Type: Article
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A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packagingReview of scientific instruments, 2015-04, Vol.86 (4), p.045106-045106 [Peer Reviewed Journal]ISSN: 0034-6748 ;EISSN: 1089-7623 ;DOI: 10.1063/1.4918621 ;PMID: 25933896Full text available |
| 12 |
Material Type: Book
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RF and Microwave Microelectronics PackagingSpringer-Verlag US 2010 ;ISBN: 1441909834 ;ISBN: 9781441909831 ;ISBN: 9781489983244 ;ISBN: 1489983244 ;EISBN: 9781441909848 ;EISBN: 1441909842 ;DOI: 10.1007/978-1-4419-0984-8 ;OCLC: 647834201Full text available |
| 13 |
Material Type: Article
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Low-temperature sintering with nano-silver paste in die-attached interconnectionJournal of electronic materials, 2007-10, Vol.36 (10), p.1333-1340 [Peer Reviewed Journal]2007 INIST-CNRS ;Copyright Minerals, Metals & Materials Society Oct 2007 ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-007-0230-5 ;CODEN: JECMA5Full text available |
| 14 |
Material Type: Book
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Thermal Stress and Strain in Microelectronics PackagingISBN: 0442010583 ;ISBN: 9780442010584 ;EISBN: 9781468477672 ;EISBN: 1468477676Full text available |
| 15 |
Material Type: Book
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High-Frequency Characterization of Electronic PackagingISBN: 0792383079 ;ISBN: 9780792383079 ;EISBN: 9781461556237 ;EISBN: 1461556236 ;OCLC: 1059411705Full text available |
| 16 |
Material Type: Article
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Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditionsScience and technology of advanced materials, 2015-06, Vol.16 (3), p.033505-33522 [Peer Reviewed Journal]2015 National Institute for Materials Science 2015 ;2015 National Institute for Materials Science ;2015 National Institute for Materials Science. This work is licensed under the Creative Commons Attribution License http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1468-6996 ;EISSN: 1878-5514 ;DOI: 10.1088/1468-6996/16/3/033505 ;PMID: 27877786 ;CODEN: STAMCVFull text available |
| 17 |
Material Type: Article
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A review of stencil printing for microelectronic packagingSoldering & surface mount technology, 2012-01, Vol.24 (1), p.38-50 [Peer Reviewed Journal]Emerald Group Publishing Limited ;2015 INIST-CNRS ;Copyright Emerald Group Publishing Limited 2012 ;ISSN: 0954-0911 ;EISSN: 1758-6836 ;DOI: 10.1108/09540911211198540 ;CODEN: SSMOEOFull text available |
| 18 |
Material Type: Book
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Failure Modes and Mechanisms in Electronic PackagesISBN: 9780412105913 ;ISBN: 0412105918 ;EISBN: 9781461560296 ;EISBN: 1461560292Full text available |
| 19 |
Material Type: Article
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Electrically conductive nanocellulose/graphene composites exhibiting improved mechanical properties in high-moisture conditionCellulose (London), 2015-06, Vol.22 (3), p.1799-1812 [Peer Reviewed Journal]Springer Science+Business Media Dordrecht 2015 ;Cellulose is a copyright of Springer, (2015). All Rights Reserved. ;ISSN: 0969-0239 ;EISSN: 1572-882X ;DOI: 10.1007/s10570-015-0622-2Full text available |
| 20 |
Material Type: Book
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LED Packaging for Lighting Applications: Design, Manufacturing, and TestingISBN: 9780470827833 ;ISBN: 0470827831 ;ISBN: 9780470827840 ;ISBN: 047082784X ;ISBN: 0470827858 ;ISBN: 9780470827857 ;EISBN: 9780470827840 ;EISBN: 047082784X ;EISBN: 0470828404 ;EISBN: 9780470828403 ;DOI: 10.1002/9780470827857 ;OCLC: 746324243 ;LCCallNum: TK7871.89.L53Full text available |
Results 1 - 20 of 318 for All Library Resources
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- Electronic Packaging (194)
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