Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Book
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Electronic components, packaging and productioninfo:eu-repo/semantics/openAccessDigital Resources/Online E-Resources |
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2 |
Material Type: Book
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Materials for high-density electronic packaging and interconnection: report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research CouncilISBN: 030904233X ;ISBN: 9780309042338 ;EISBN: 9780309536691 ;EISBN: 0309536693Full text available |
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3 |
Material Type: Book
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Electronic components, packaging and productionCopyright Leif Halbo ;ISBN: 9788299219327 ;ISBN: 8299219329Digital Resources/Online E-Resources |
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4 |
Material Type: Book
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Materials for High-Density Electronic Packaging and InterconnectionISBN: 030904233X ;ISBN: 9780309042338 ;EISBN: 9780309536691 ;EISBN: 0309536693 ;OCLC: 923266410Full text available |
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5 |
Material Type: Book
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MCM C/Mixed Technologies and Thick Film SensorsKluwer Academic Publishers 1995 ;ISSN: 1388-6576 ;ISBN: 9789401040396 ;ISBN: 9401040397 ;ISBN: 9780792334606 ;ISBN: 0792334604 ;ISBN: 9401100802 ;ISBN: 9789401100809 ;EISBN: 9401100799 ;EISBN: 9789401100793 ;DOI: 10.1007/978-94-011-0079-3 ;OCLC: 958521925 ;OCLC: 1245665253Full text available |
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6 |
Material Type: Book
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Thermal Stress and Strain in Microelectronics PackagingSpringer-Verlag US 1993 ;ISBN: 9781468477696 ;ISBN: 1468477692 ;ISBN: 0442010583 ;ISBN: 1468477684 ;ISBN: 9780442010584 ;ISBN: 9781468477689 ;EISBN: 9781468477672 ;EISBN: 1468477676 ;DOI: 10.1007/978-1-4684-7767-2 ;OCLC: 934973487Full text available |
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7 |
Material Type: Book
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Electronics Packaging Forum: Volume TwoSpringer Science+Business Media B.V. 1991 ;ISBN: 9789401066815 ;ISBN: 9401066817 ;ISBN: 9780442004767 ;ISBN: 0442004761 ;ISBN: 9400904401 ;ISBN: 9789400904408 ;EISBN: 9400904398 ;EISBN: 9789400904392 ;DOI: 10.1007/978-94-009-0439-2 ;OCLC: 936325488 ;OCLC: 913622177Full text available |
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8 |
Material Type: Book
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Conceptual Design of Multichip Modules and SystemsSpringer-Verlag US 1994 ;ISSN: 0893-3405 ;ISBN: 9781441951373 ;ISBN: 1441951377 ;ISBN: 0792393953 ;ISBN: 9780792393955 ;ISBN: 9781475748420 ;ISBN: 1475748426 ;EISBN: 1475748418 ;EISBN: 9781475748413 ;DOI: 10.1007/978-1-4757-4841-3 ;OCLC: 934975542 ;OCLC: 1283855289Full text available |
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9 |
Material Type: Book
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Physical Design for Multichip ModulesKluwer Academic Publishers 1994 ;ISSN: 0893-3405 ;ISBN: 1461361532 ;ISBN: 9781461361534 ;ISBN: 079239450X ;ISBN: 9780792394501 ;ISBN: 1461526833 ;ISBN: 9781461526834 ;EISBN: 1461526825 ;EISBN: 9781461526827 ;DOI: 10.1007/978-1-4615-2682-7 ;OCLC: 958562613 ;OCLC: 1245665001Full text available |
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10 |
Material Type: Book
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ESD from a to Z: Electrostatic Discharge Control for ElectronicsSpringer-Verlag US 1996 ;ISBN: 9780412083815 ;ISBN: 0412083817 ;ISBN: 9781461311782 ;ISBN: 9781461284994 ;ISBN: 1461284996 ;ISBN: 1461311780 ;EISBN: 9781461311775 ;EISBN: 1461311772 ;DOI: 10.1007/978-1-4613-1177-5 ;OCLC: 1242889498Full text available |
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11 |
Material Type: Book
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Structural Analysis of Printed Circuit Board SystemsSpringer-Verlag New York, Inc. 1993 ;ISSN: 0941-5122 ;ISBN: 9781461269458 ;ISBN: 1461269458 ;ISBN: 9780387979397 ;ISBN: 0387979395 ;ISBN: 1461209161 ;ISBN: 9781461209164 ;EISSN: 2192-063X ;EISBN: 9781461209157 ;EISBN: 1461209153 ;DOI: 10.1007/978-1-4612-0915-7 ;OCLC: 958524428 ;OCLC: 1243543842Full text available |
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12 |
Material Type: Book
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component AssemblyVan Nostrand Reinhold 1992 ;ISBN: 0442013531 ;ISBN: 9780442013530 ;ISBN: 9781461535294 ;ISBN: 1461535298 ;EISBN: 9781461535287 ;EISBN: 146153528X ;DOI: 10.1007/978-1-4615-3528-7 ;OCLC: 1239989510Full text available |
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13 |
Material Type: Book
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Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing TechniquesVan Nostrand Reinhold 1992 ;ISBN: 9780442008628 ;ISBN: 0442008627 ;ISBN: 9781461365679 ;ISBN: 1461535336 ;ISBN: 1461365678 ;ISBN: 9781461535331 ;EISBN: 9781461535324 ;EISBN: 1461535328 ;DOI: 10.1007/978-1-4615-3532-4 ;OCLC: 1239982441Full text available |
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14 |
Material Type: Book
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Electronics Assembly HandbookSpringer-Verlag Berlin Heidelberg 1988 ;ISBN: 9783662131633 ;ISBN: 3662131633 ;ISBN: 3662131625 ;ISBN: 9783540194491 ;ISBN: 9783662131626 ;ISBN: 3540194495 ;EISBN: 9783662131619 ;EISBN: 3662131617 ;DOI: 10.1007/978-3-662-13161-9 ;OCLC: 936319220Full text available |
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15 |
Material Type: Article
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Evaluation of a proposed test method to measure surface and volume resistance of static dissipative packaging materialsPackaging technology & science, 1994-11, Vol.7 (6), p.283-289 [Peer Reviewed Journal]Copyright © 1994 John Wiley & Sons, Ltd ;ISSN: 0894-3214 ;EISSN: 1099-1522 ;DOI: 10.1002/pts.2770070605Full text available |
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16 |
Material Type: Book
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Electronic Equipment Packaging TechnologyVan Nostrand Reinhold 1992 ;ISBN: 9780442238186 ;ISBN: 0442238185 ;EISBN: 1461535425 ;EISBN: 9781461535423 ;DOI: 10.1007/978-1-4615-3542-3 ;OCLC: 1239991929Full text available |
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17 |
Material Type: Book
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Newnes Electronics Assembly Pocket BookISBN: 0750602228 ;ISBN: 9780750602228 ;EISBN: 1483291936 ;EISBN: 9781483291932 ;OCLC: 895247679Full text available |
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18 |
Material Type: Book
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Controlling Radiated Emissions by DesignISBN: 9781461363569 ;ISBN: 146136356X ;ISBN: 9780442009496 ;ISBN: 9781461531036 ;ISBN: 0442009496 ;ISBN: 1461531039 ;EISBN: 1461531020 ;EISBN: 9781461531029 ;DOI: 10.1007/978-1-4615-3102-9 ;OCLC: 935298970Full text available |
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19 |
Material Type: Thesises (postgraduate)
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The design and implementation of a flexible manufacturing system for a surface mounting production lineDigital Resources/Online E-Resources |
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20 |
Material Type: Article
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Laser ablation of polymers for high-density interconnectMicroelectronic engineering, 1993, Vol.20 (1), p.15-29 [Peer Reviewed Journal]1993 ;ISSN: 0167-9317 ;EISSN: 1873-5568 ;DOI: 10.1016/0167-9317(93)90204-IFull text available |