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Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2019-01, Vol.50 (1), p.480-492 [Peer Reviewed Journal]

The Minerals, Metals & Materials Society and ASM International 2018 ;Metallurgical and Materials Transactions A is a copyright of Springer, (2018). All Rights Reserved. ;ISSN: 1073-5623 ;EISSN: 1543-1940 ;DOI: 10.1007/s11661-018-4983-7

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Title:
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
Author: Zhang, Zhe ; Hu, Xiaowu ; Jiang, Xiongxin ; Li, Yulong
Subjects: Atomic properties ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Diffusion barriers ; Diffusion layers ; Diffusion plating ; Intermetallic compounds ; Materials Science ; Metallic Materials ; Nanotechnology ; Nickel ; Phase transitions ; Protective coatings ; Rate constants ; Soldered joints ; Structural Materials ; Substrates ; Surfaces and Interfaces ; Thin Films ; Tin ; Tin base alloys
Is Part Of: Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2019-01, Vol.50 (1), p.480-492
Description: The interfacial microstructures of Sn-3.0Ag-0.5Cu (SAC305) solder systems with thin Ni(P) mono-coatings and Cu-Ni(P) dual-coatings were investigated after reflowing and isothermal aging. The ultrathin mono-Ni(P) plating of the SAC305/Ni(P) solder joint was found to rapidly decompose and then transform into a Ni 2 SnP phase. An intermetallic compound (IMC) formed at the plating/substrate interface, indicating that the ultrathin mono-Ni(P) plating was not an effective diffusion barrier. However, only a single IMC layer ((Cu,Ni) 6 Sn 5 ) formed at the solder/plating interface in the SAC305/Cu/Ni(P)/Cu system. The (Cu,Ni) 6 Sn 5 IMC effectively suppressed atomic diffusion, protecting the Ni(P) plating and Cu substrate. Although P-Sn-O pores formed in the root of the (Cu,Ni) 6 Sn 5 IMC layer, the dual-Cu/Ni(P) plating protected the solder system for an extended period. The IMC growth rate constants of the SAC305/Cu, SAC305/Ni(P), and SAC305/Cu/Ni(P)/Cu solder joint systems were 0.180, 0.342, and 0.068 μ m/h 1/2 , respectively. These results indicate that the application of dual-Cu/Ni(P) plating can effectively hinder the growth of IMC.
Publisher: New York: Springer US
Language: English
Identifier: ISSN: 1073-5623
EISSN: 1543-1940
DOI: 10.1007/s11661-018-4983-7
Source: ProQuest Central

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Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

The Minerals, Metals & Materials Society and ASM International 2018 ;Metallurgical and Materials Transactions A is a copyright of Springer, (2018). All Rights Reserved. ;ISSN: 1073-5623 ;EISSN: 1543-1940 ;DOI: 10.1007/s11661-018-4983-7

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