Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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Material Type: Conference Proceeding
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Development of high strength bamboo paper using parenchyma cellsTransactions on the built environment, 2008, Vol.97, p.241-2492015 INIST-CNRS ;2008. Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the associated terms available at https://www.witpress.com/elibrary . ;ISSN: 1746-4498 ;ISBN: 184564106X ;ISBN: 9781845641061 ;EISSN: 1743-3509 ;DOI: 10.2495/HPSM080261Full text available |
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Material Type: Conference Proceeding
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Determination of mechanical properties of okra, sisal fibre and polyester based hybrid compositeE3S Web of Conferences, 2021, Vol.309, p.1153 [Peer Reviewed Journal]2021. This work is licensed under https://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2267-1242 ;ISSN: 2555-0403 ;EISSN: 2267-1242 ;DOI: 10.1051/e3sconf/202130901153Full text available |
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3 |
Material Type: Conference Proceeding
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Research on Innovative Design Method and Application of Architectural Façade ModelingMATEC Web of Conferences, 2019, Vol.267, p.2012 [Peer Reviewed Journal]2019. This work is licensed under http://creativecommons.org/licenses/by/4.0 (the “License”). Notwithstanding the ProQuest Terms and conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2261-236X ;ISSN: 2274-7214 ;EISSN: 2261-236X ;DOI: 10.1051/matecconf/201926702012Full text available |
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4 |
Material Type: Conference Proceeding
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Research on the Application of Tactile Materials to Design and Printing of BooksMATEC Web of Conferences, 2016, Vol.52, p.2006 [Peer Reviewed Journal]2016. This work is licensed under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2261-236X ;ISSN: 2274-7214 ;EISSN: 2261-236X ;DOI: 10.1051/matecconf/20165202006Full text available |