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1
Development of a deep learning platform for optimising sheet stamping geometries subject to manufacturing constraints
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Development of a deep learning platform for optimising sheet stamping geometries subject to manufacturing constraints

arXiv.org, 2022-02

2022. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2202.03422

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2
Image-based Artificial Intelligence empowered surrogate model and shape morpher for real-time blank shape optimisation in the hot stamping process
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Image-based Artificial Intelligence empowered surrogate model and shape morpher for real-time blank shape optimisation in the hot stamping process

arXiv.org, 2022-12

2022. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2212.05885

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3
Rapid feasibility assessment of components formed through hot stamping: A deep learning approach
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Rapid feasibility assessment of components formed through hot stamping: A deep learning approach

arXiv.org, 2021-04

2021. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2104.13199

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4
Nanobubble induced formation of quantum emitters in monolayer semiconductors
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Nanobubble induced formation of quantum emitters in monolayer semiconductors

arXiv.org, 2016-12

2016. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.1612.06416

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