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Standards
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Standards
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Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICsElectron Devices, IEEE Transactions on, 2023, Vol.70, p.222-2291963-2012 IEEE ;DOI: 10.1109/TED.2022.3224892Full text available |
| 2 |
Material Type: Standards
|
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Enhanced Wide Spectrum Photocatalytic Activity by in-Situ Magnetite-Graphite Nanoplatelets HeterostructureAccess, IEEE, 2023, Vol.11, p.68912-689242013 IEEE ;DOI: 10.1109/ACCESS.2023.3290029Full text available |
| 3 |
Material Type: Standards
|
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Experimental Demonstration of the Impact of the Parameters of Floating Guard Ring on Planar InP/InGaAs-Based Avalanche Photodiodes' Performance and Its OptimizationPhotonics Journal, IEEE, 2022, Vol.14, p.1-62009-2012 IEEE ;DOI: 10.1109/JPHOT.2022.3153649Full text available |
| 4 |
Material Type: Standards
|
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Comparison and combination of imaging techniques for three dimensional analysis of electrical treesDielectrics and Electrical Insulation, IEEE Transactions on, 2015, Vol.22, p.709-7191994-2012 IEEE ;DOI: 10.1109/TDEI.2014.004730Full text available |
| 5 |
Material Type: Standards
|
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Imaging and analysis techniques for electrical trees using X-ray computed tomographyDielectrics and Electrical Insulation, IEEE Transactions on, 2014, Vol.21, p.53-631994-2012 IEEE ;DOI: 10.1109/TDEI.2013.003911Full text available |
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