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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Patent
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LOW-COST MASK PUNCH FLOWDigital Resources/Online E-Resources |
| 2 |
Material Type: Patent
|
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Low cost optical packageDigital Resources/Online E-Resources |
| 3 |
Material Type: Patent
|
|
Low cost package warpage solutionDigital Resources/Online E-Resources |
| 4 |
Material Type: Patent
|
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LOW COST PACKAGE WARPAGE SOLUTIONDigital Resources/Online E-Resources |
| 5 |
Material Type: Patent
|
|
Low cost micro OLED structure and methodDigital Resources/Online E-Resources |
| 6 |
Material Type: Patent
|
|
Memory for reducing cost and power consumptionDigital Resources/Online E-Resources |
| 7 |
Material Type: Patent
|
|
Low cost package warpage solutionDigital Resources/Online E-Resources |
| 8 |
Material Type: Patent
|
|
LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTUREDigital Resources/Online E-Resources |
| 9 |
Material Type: Patent
|
|
LOW COST PANEL AESA WITH THERMAL MANAGEMENTDigital Resources/Online E-Resources |
| 10 |
Material Type: Patent
|
|
LOW COST EMBEDDED INTEGRATED CIRCUIT DIESDigital Resources/Online E-Resources |
| 11 |
Material Type: Patent
|
|
UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABRICATION COSTS AND INCREASE PERFORMANCEDigital Resources/Online E-Resources |
| 12 |
Material Type: Patent
|
|
LOW COST WAFER LEVEL PACKAGES AND SILICONDigital Resources/Online E-Resources |
| 13 |
Material Type: Patent
|
|
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIESDigital Resources/Online E-Resources |
| 14 |
Material Type: Patent
|
|
LOW-COST SURFACE MOUNT EMI GASKETSDigital Resources/Online E-Resources |
| 15 |
Material Type: Patent
|
|
LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTUREDigital Resources/Online E-Resources |
| 16 |
Material Type: Patent
|
|
Low-cost nano-heat pipeDigital Resources/Online E-Resources |
| 17 |
Material Type: Patent
|
|
Low Cost In-Package Power InductorDigital Resources/Online E-Resources |
| 18 |
Material Type: Patent
|
|
METHOD FOR ROAD DEBRIS DETECTION USING LOW-COST LIDARDigital Resources/Online E-Resources |
| 19 |
Material Type: Patent
|
|
Low cost three-dimensional stacking semiconductor assembliesDigital Resources/Online E-Resources |
| 20 |
Material Type: Patent
|
|
Low cost millimiter wave integrated LTCC packageDigital Resources/Online E-Resources |
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