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1	Material Type: Article	Molecular dynamics simulation of kinetic boundary conditions and evaporation/condensation coefficients of direct-contact condensation in two-phase jet AIP advances, 2022-05, Vol.12 (5), p.055010-055010-15 [Peer Reviewed Journal] Author(s) ;2022 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). ;ISSN: 2158-3226 ;EISSN: 2158-3226 ;DOI: 10.1063/5.0092010 ;CODEN: AAIDBI Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
2	Material Type: Article	Thermoelectric transport properties of diamond-like Cu1−xFe1+xS2 tetrahedral compounds Journal of applied physics, 2014-11, Vol.116 (20) [Peer Reviewed Journal] ISSN: 0021-8979 ;EISSN: 1089-7550 ;DOI: 10.1063/1.4902849 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
3	Material Type: Article	Influence of Loading Directions on Dynamic Compressive Properties of Mill-Annealed Ti-6Al-4V Thick Plate Materials, 2022-10, Vol.15 (20), p.7047 [Peer Reviewed Journal] COPYRIGHT 2022 MDPI AG ;2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2022 by the authors. 2022 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma15207047 ;PMID: 36295116 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
4	Material Type: Article	Heat Treatment Optimization for a High Strength Al-Mn-Sc Alloy Fabricated by Selective Laser Melting Materials, 2023-05, Vol.16 (11), p.4054 [Peer Reviewed Journal] 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2023 by the authors. 2023 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma16114054 ;PMID: 37297189 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
5	Material Type: Article	Wetting and Spreading of AgCuTi on Selective Laser-Melted Ti-6Al-4V Materials, 2021-08, Vol.14 (17), p.4804 [Peer Reviewed Journal] 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2021 by the authors. 2021 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma14174804 ;PMID: 34500894 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
6	Material Type: Article	Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux Journal of materials science. Materials in electronics, 2021-10, Vol.32 (19), p.24507-24523 [Peer Reviewed Journal] The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021 ;The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-021-06929-9 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
7	Material Type: Article	Investigation of the Mechanical Behaviors and Damage Mechanism of C/C Composites Impacted by High-Velocity Jets Materials, 2024-02, Vol.17 (4), p.963 [Peer Reviewed Journal] COPYRIGHT 2024 MDPI AG ;2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma17040963 ;PMID: 38399213 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
8	Material Type: Article	A New Tooth Profile Modification Method of Cycloidal Gears in Precision Reducers for Robots Applied sciences, 2020-02, Vol.10 (4), p.1266 [Peer Reviewed Journal] 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2076-3417 ;EISSN: 2076-3417 ;DOI: 10.3390/app10041266 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
9	Material Type: Article	Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging Materials, 2018-01, Vol.11 (1), p.84 [Peer Reviewed Journal] Copyright MDPI AG 2018 ;2018 by the authors. 2018 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma11010084 ;PMID: 29316625 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
10	Material Type: Article	Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging Journal of materials science. Materials in electronics, 2019-01, Vol.30 (2), p.1519-1530 [Peer Reviewed Journal] Springer Science+Business Media, LLC, part of Springer Nature 2018 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2018). All Rights Reserved. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-018-0423-0 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
11	Material Type: Article	Numerical Simulations for Indirect and Direct Cooling of 54 V LiFePO4 Battery Pack Energies (Basel), 2022-07, Vol.15 (13), p.4581 [Peer Reviewed Journal] 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1996-1073 ;EISSN: 1996-1073 ;DOI: 10.3390/en15134581 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
12	Material Type: Article	Impact source identification in finite isotropic plates using a time-reversal method: experimental study Smart materials and structures, 2012-10, Vol.21 (10), p.105025 [Peer Reviewed Journal] 2012 IOP Publishing Ltd ;2015 INIST-CNRS ;ISSN: 0964-1726 ;EISSN: 1361-665X ;DOI: 10.1088/0964-1726/21/10/105025 ;CODEN: SMSTER Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
13	Material Type: Article	Wetting Kinetics and Microstructure Analysis of BNi2 Filler Metal over Selective Laser Melted Ti-6Al-4V Substrate Materials, 2020-10, Vol.13 (20), p.4666 [Peer Reviewed Journal] 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2020 by the authors. 2020 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma13204666 ;PMID: 33092040 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
14	Material Type: Article	Reinforcement-Learning-Based Tracking Control with Fixed-Time Prescribed Performance for Reusable Launch Vehicle under Input Constraints Applied sciences, 2022-08, Vol.12 (15), p.7436 [Peer Reviewed Journal] 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2076-3417 ;EISSN: 2076-3417 ;DOI: 10.3390/app12157436 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
15	Material Type: Article	Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate Journal of materials science. Materials in electronics, 2013-06, Vol.24 (6), p.2027-2034 [Peer Reviewed Journal] Springer Science+Business Media New York 2012 ;2014 INIST-CNRS ;Springer Science+Business Media New York 2013 ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-012-1052-7 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
16	Material Type: Article	Coupling effect of boundary tribofilm and hydrodynamic film Cell reports physical science, 2022-03, Vol.3 (3), p.100778, Article 100778 [Peer Reviewed Journal] 2022 The Author(s) ;ISSN: 2666-3864 ;EISSN: 2666-3864 ;DOI: 10.1016/j.xcrp.2022.100778 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
17	Material Type: Article	Coupling and Decoupling Measurement Method of Complete Geometric Errors for Multi-Axis Machine Tools Applied sciences, 2020-03, Vol.10 (6), p.2164 [Peer Reviewed Journal] 2020. This work is licensed under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2076-3417 ;EISSN: 2076-3417 ;DOI: 10.3390/app10062164 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
18	Material Type: Article	Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints Journal of materials science. Materials in electronics, 2018-11, Vol.29 (21), p.18404-18416 [Peer Reviewed Journal] Springer Science+Business Media, LLC, part of Springer Nature 2018 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2018). All Rights Reserved. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-018-9955-6 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
19	Material Type: Article	Theoretical and experimental investigations on mechanical properties of Co1−xNixSn2 intermetallic compounds Results in physics, 2019-09, Vol.14 [Peer Reviewed Journal] ISSN: 2211-3797 ;EISSN: 2211-3797 ;DOI: 10.1016/j.rinp.2019.102439 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
20	Material Type: Article	Progressive Failure Simulation of Notched Tensile Specimen for Triaxially-Braided Composites Materials, 2019-03, Vol.12 (5), p.833 [Peer Reviewed Journal] 2019. This work is licensed under https://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2019 by the authors. 2019 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/MA12050833 ;PMID: 30871012 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by

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Results 1 - 20 of 983 for All Library Resources

Author(s) ;2022 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). ;ISSN: 2158-3226 ;EISSN: 2158-3226 ;DOI: 10.1063/5.0092010 ;CODEN: AAIDBI

ISSN: 0021-8979 ;EISSN: 1089-7550 ;DOI: 10.1063/1.4902849

The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021 ;The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-021-06929-9

Copyright MDPI AG 2018 ;2018 by the authors. 2018 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma11010084 ;PMID: 29316625

Springer Science+Business Media, LLC, part of Springer Nature 2018 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2018). All Rights Reserved. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-018-0423-0

2012 IOP Publishing Ltd ;2015 INIST-CNRS ;ISSN: 0964-1726 ;EISSN: 1361-665X ;DOI: 10.1088/0964-1726/21/10/105025 ;CODEN: SMSTER

Springer Science+Business Media New York 2012 ;2014 INIST-CNRS ;Springer Science+Business Media New York 2013 ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-012-1052-7

2022 The Author(s) ;ISSN: 2666-3864 ;EISSN: 2666-3864 ;DOI: 10.1016/j.xcrp.2022.100778

2020. This work is licensed under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2076-3417 ;EISSN: 2076-3417 ;DOI: 10.3390/app10062164

Springer Science+Business Media, LLC, part of Springer Nature 2018 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2018). All Rights Reserved. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-018-9955-6

ISSN: 2211-3797 ;EISSN: 2211-3797 ;DOI: 10.1016/j.rinp.2019.102439

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