Results 1 - 20 of 1,469 for All Library Resources
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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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| 1 |
Material Type: Book
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and TestingISBN: 0470827807 ;ISBN: 9780470827802 ;ISBN: 9780470827819 ;ISBN: 0470827815 ;ISBN: 0470827823 ;ISBN: 9780470827826 ;EISBN: 9780470827819 ;EISBN: 0470827815 ;EISBN: 0470828412 ;EISBN: 9780470828410 ;DOI: 10.1002/9780470827826 ;OCLC: 756280855 ;LCCallNum: TK7870.15Full text available |
| 2 |
Material Type: Article
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Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas SensorsIEEE access, 2022-01, Vol.10, p.19242-19253 [Peer Reviewed Journal]Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 ;ISSN: 2169-3536 ;EISSN: 2169-3536 ;DOI: 10.1109/ACCESS.2022.3151356 ;CODEN: IAECCGFull text available |
| 3 |
Material Type: Article
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Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging ApplicationsJournal of electronic materials, 2020, Vol.49 (1), p.212-225 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2019 ;Journal of Electronic Materials is a copyright of Springer, (2019). All Rights Reserved. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-019-07681-xFull text available |
| 4 |
Material Type: Book
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Advanced Materials for Thermal Management of Electronic PackagingSpringer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360Full text available |
| 5 |
Material Type: Article
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PIXAPP Photonics Packaging Pilot Line - Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber ConnectivityIEEE journal of selected topics in quantum electronics, 2022-05, Vol.28 (3: Hybrid Integration for Silicon Photonics), p.1-11 [Peer Reviewed Journal]ISSN: 1077-260X ;EISSN: 1558-4542 ;DOI: 10.1109/JSTQE.2022.3158891 ;CODEN: IJSQENDigital Resources/Online E-Resources |
| 6 |
Material Type: Article
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Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current StressingJournal of electronic materials, 2024-03, Vol.53 (3), p.1192-1200 [Peer Reviewed Journal]The Author(s) 2023 ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-023-10853-5Digital Resources/Online E-Resources |
| 7 |
Material Type: Article
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Low-voltage 2D materials-based printed field-effect transistors for integrated digital and analog electronics on paperNature communications, 2020-07, Vol.11 (1), p.3566-3566, Article 3566 [Peer Reviewed Journal]The Author(s) 2020. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2020 ;ISSN: 2041-1723 ;EISSN: 2041-1723 ;DOI: 10.1038/s41467-020-17297-z ;PMID: 32678084Full text available |
| 8 |
Material Type: Article
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Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal managementNature communications, 2021-02, Vol.12 (1), p.1284-1284, Article 1284 [Peer Reviewed Journal]The Author(s) 2021. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2021 ;ISSN: 2041-1723 ;EISSN: 2041-1723 ;DOI: 10.1038/s41467-021-21531-7 ;PMID: 33627644Full text available |
| 9 |
Material Type: Article
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Surface Precipitation and Growth of Bismuth Particles in Sn-Ag-Cu-Bi Solder JointsJournal of electronic materials, 2023-02, Vol.52 (2), p.801-809 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10126-7Full text available |
| 10 |
Material Type: Article
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The Failure of Sn-Bi-Based Solder Joints Due to Current StressingJournal of electronic materials, 2023-02, Vol.52 (2), p.751-759 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10086-yFull text available |
| 11 |
Material Type: Article
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Sweat permeable and ultrahigh strength 3D PVDF piezoelectric nanoyarn fabric strain sensorNature communications, 2024-04, Vol.15 (1), p.3509-3509 [Peer Reviewed Journal]2024. The Author(s). ;The Author(s) 2024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;EISSN: 2041-1723 ;DOI: 10.1038/s41467-024-47810-7 ;PMID: 38664454Full text available |
| 12 |
Material Type: Article
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Nanopolystyrene translocation and fetal deposition after acute lung exposure during late-stage pregnancyParticle and fibre toxicology, 2020-10, Vol.17 (1), p.1-11, Article 55 [Peer Reviewed Journal]COPYRIGHT 2020 BioMed Central Ltd. ;2020. This work is licensed under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2020 ;ISSN: 1743-8977 ;EISSN: 1743-8977 ;DOI: 10.1186/s12989-020-00385-9 ;PMID: 33099312Full text available |
| 13 |
Material Type: Article
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Finite Element Method Analysis of Fatigue and Damage in Low-Temperature-Sintered Nano-silver Soldered JointsJournal of electronic materials, 2023-02, Vol.52 (2), p.760-772 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10097-9Full text available |
| 14 |
Material Type: Article
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Intermediate Low-Melting-Temperature Solder Thermal Cycling Enhancement Using Bismuth and Indium MicroalloyingJournal of electronic materials, 2023-02, Vol.52 (2), p.810-818 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10121-yFull text available |
| 15 |
Material Type: Article
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Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic DevicesJournal of electronic materials, 2023-02, Vol.52 (2), p.792-800 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10118-7Full text available |
| 16 |
Material Type: Article
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Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling TestsJournal of electronic materials, 2021-12, Vol.50 (12), p.6597-6606 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2021 ;The Minerals, Metals & Materials Society 2021. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-021-09221-yFull text available |
| 17 |
Material Type: Article
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A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readoutApplied physics letters, 2015-05, Vol.106 (19) [Peer Reviewed Journal]ISSN: 0003-6951 ;EISSN: 1077-3118 ;DOI: 10.1063/1.4921318Full text available |
| 18 |
Material Type: Article
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Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°CPower electronic devices and components, 2022-10, Vol.3, p.100014, Article 100014 [Peer Reviewed Journal]2022 ;ISSN: 2772-3704 ;EISSN: 2772-3704 ;DOI: 10.1016/j.pedc.2022.100014Full text available |
| 19 |
Material Type: Article
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Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu JointsJournal of electronic materials, 2023-02, Vol.52 (2), p.739-750 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10065-3Full text available |
| 20 |
Material Type: Article
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Hybrid Solder Joint for Low-Temperature Bonding ApplicationJournal of electronic materials, 2023-02, Vol.52 (2), p.782-791 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-022-10111-0Full text available |
Results 1 - 20 of 1,469 for All Library Resources
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