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Peer-reviewed Journals (122)

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1	Material Type: Book	Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing ISBN: 0470827807 ;ISBN: 9780470827802 ;ISBN: 9780470827819 ;ISBN: 0470827815 ;ISBN: 0470827823 ;ISBN: 9780470827826 ;EISBN: 9780470827819 ;EISBN: 0470827815 ;EISBN: 0470828412 ;EISBN: 9780470828410 ;DOI: 10.1002/9780470827826 ;OCLC: 756280855 ;LCCallNum: TK7870.15 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
2	Material Type: Book	Advanced Materials for Thermal Management of Electronic Packaging Springer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
3	Material Type: Article	Low-voltage 2D materials-based printed field-effect transistors for integrated digital and analog electronics on paper Nature communications, 2020-07, Vol.11 (1), p.3566-3566, Article 3566 [Peer Reviewed Journal] The Author(s) 2020. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2020 ;ISSN: 2041-1723 ;EISSN: 2041-1723 ;DOI: 10.1038/s41467-020-17297-z ;PMID: 32678084 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
4	Material Type: Article	Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management Nature communications, 2021-02, Vol.12 (1), p.1284-1284, Article 1284 [Peer Reviewed Journal] The Author(s) 2021. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;The Author(s) 2021 ;ISSN: 2041-1723 ;EISSN: 2041-1723 ;DOI: 10.1038/s41467-021-21531-7 ;PMID: 33627644 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
5	Material Type: Article	Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests Journal of electronic materials, 2021-12, Vol.50 (12), p.6597-6606 [Peer Reviewed Journal] The Minerals, Metals & Materials Society 2021 ;The Minerals, Metals & Materials Society 2021. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-021-09221-y Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
6	Material Type: Article	Study on sintering properties of aluminum oxide nano-powder for electronics packaging Journal of physics. Conference series, 2024-02, Vol.2713 (1), p.012004 [Peer Reviewed Journal] Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2713/1/012004 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
7	Material Type: Article	Theoretical and experimental studies of spring-buffer chip peeling technology for electronics packaging International journal of fracture, 2022-07, Vol.236 (1), p.109-124 [Peer Reviewed Journal] The Author(s), under exclusive licence to Springer Nature B.V. 2022 ;The Author(s), under exclusive licence to Springer Nature B.V. 2022. ;ISSN: 0376-9429 ;EISSN: 1573-2673 ;DOI: 10.1007/s10704-022-00637-z Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
8	Material Type: Book	Moisture Sensitivity of Plastic Packages of IC Devices Springer Science+Business Media, LLC 2010 ;ISBN: 9781441957184 ;ISBN: 1441957189 ;ISBN: 1441957197 ;ISBN: 9781441957191 ;EISBN: 1441957197 ;EISBN: 9781441957191 ;DOI: 10.1007/978-1-4419-5719-1 ;OCLC: 663096136 ;LCCallNum: TK7870.15 .M65 2010eb Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
9	Material Type: Article	Thermal-Mechanical Property of High Aspect Ratio TSV in Advanced IC integration and Packaging Journal of physics. Conference series, 2024-04, Vol.2740 (1), p.012054 [Peer Reviewed Journal] Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2740/1/012054 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
10	Material Type: Article	Packaged Ga2O3 Schottky Rectifiers with Over 60 A Surge Current Capability IEEE transactions on power electronics, 2021-08 [Peer Reviewed Journal] Distributed under a Creative Commons Attribution 4.0 International License ;ISSN: 0885-8993 ;EISSN: 1941-0107 ;DOI: 10.1109/TPEL.2021.3049966 Digital Resources/Online E-Resources View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
11	Material Type: Article	Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring Metals (Basel ), 2021-10, Vol.11 (10), p.1537 [Peer Reviewed Journal] 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2075-4701 ;EISSN: 2075-4701 ;DOI: 10.3390/met11101537 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
12	Material Type: Book	Materials for Advanced Packaging Springer-Verlag US 2009 ;ISBN: 9780387782188 ;ISBN: 0387782184 ;EISBN: 0387782192 ;EISBN: 9780387782195 ;DOI: 10.1007/978-0-387-78219-5 ;OCLC: 426487487 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
13	Material Type: Article	Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials IEEE transactions on power electronics, 2022-06 [Peer Reviewed Journal] Distributed under a Creative Commons Attribution 4.0 International License ;ISSN: 0885-8993 ;EISSN: 1941-0107 ;DOI: 10.1109/TPEL.2022.3142273 Digital Resources/Online E-Resources View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
14	Material Type: Article	Soft Wireless Bioelectronics and Differential Electrodermal Activity for Home Sleep Monitoring Sensors (Basel, Switzerland), 2021-01, Vol.21 (2), p.354 [Peer Reviewed Journal] 2021. This work is licensed under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2021 by the authors. 2021 ;ISSN: 1424-8220 ;EISSN: 1424-8220 ;DOI: 10.3390/s21020354 ;PMID: 33430220 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
15	Material Type: Article	Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy Coatings (Basel), 2023-02, Vol.13 (2), p.237 [Peer Reviewed Journal] 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2079-6412 ;EISSN: 2079-6412 ;DOI: 10.3390/coatings13020237 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
16	Material Type: Article	Graphene and Carbon Nanotubes for Electronics Nanopackaging IEEE open journal of nanotechnology, 2021-01, Vol.2, p.120-128 [Peer Reviewed Journal] Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2021 ;Distributed under a Creative Commons Attribution 4.0 International License ;ISSN: 2644-1292 ;EISSN: 2644-1292 ;DOI: 10.1109/OJNANO.2021.3127652 ;CODEN: IOJNAY Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
17	Material Type: Book	RF and Microwave Microelectronics Packaging Springer-Verlag US 2010 ;ISBN: 1441909834 ;ISBN: 9781441909831 ;ISBN: 9781489983244 ;ISBN: 1489983244 ;EISBN: 9781441909848 ;EISBN: 1441909842 ;DOI: 10.1007/978-1-4419-0984-8 ;OCLC: 647834201 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
18	Material Type: Article	Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging Processes, 2021-09, Vol.9 (9), p.1634 [Peer Reviewed Journal] 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2227-9717 ;EISSN: 2227-9717 ;DOI: 10.3390/pr9091634 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
19	Material Type: Article	Flame-Retardant Cycloaliphatic Epoxy Systems with High Dielectric Performance for Electronic Packaging Materials International journal of molecular sciences, 2023-01, Vol.24 (3), p.2301 [Peer Reviewed Journal] 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2023 by the authors. 2023 ;ISSN: 1422-0067 ;ISSN: 1661-6596 ;EISSN: 1422-0067 ;DOI: 10.3390/ijms24032301 ;PMID: 36768624 Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by
20	Material Type: Article	High resolution steady-state measurements of thermal contact resistance across thermal interface material junctions Review of scientific instruments, 2017-09, Vol.88 (9), p.094901-094901 [Peer Reviewed Journal] Author(s) ;ISSN: 0034-6748 ;EISSN: 1089-7623 ;DOI: 10.1063/1.5001835 ;PMID: 28964213 ;CODEN: RSINAK Full text available View Online Details Recommendations Reviews Times Cited External Links Citations Cited by

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Results 1 - 20 of 212 for All Library Resources

ISBN: 0470827807 ;ISBN: 9780470827802 ;ISBN: 9780470827819 ;ISBN: 0470827815 ;ISBN: 0470827823 ;ISBN: 9780470827826 ;EISBN: 9780470827819 ;EISBN: 0470827815 ;EISBN: 0470828412 ;EISBN: 9780470828410 ;DOI: 10.1002/9780470827826 ;OCLC: 756280855 ;LCCallNum: TK7870.15

Springer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360

The Minerals, Metals & Materials Society 2021 ;The Minerals, Metals & Materials Society 2021. ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-021-09221-y

The Author(s), under exclusive licence to Springer Nature B.V. 2022 ;The Author(s), under exclusive licence to Springer Nature B.V. 2022. ;ISSN: 0376-9429 ;EISSN: 1573-2673 ;DOI: 10.1007/s10704-022-00637-z

Springer Science+Business Media, LLC 2010 ;ISBN: 9781441957184 ;ISBN: 1441957189 ;ISBN: 1441957197 ;ISBN: 9781441957191 ;EISBN: 1441957197 ;EISBN: 9781441957191 ;DOI: 10.1007/978-1-4419-5719-1 ;OCLC: 663096136 ;LCCallNum: TK7870.15 .M65 2010eb

Distributed under a Creative Commons Attribution 4.0 International License ;ISSN: 0885-8993 ;EISSN: 1941-0107 ;DOI: 10.1109/TPEL.2021.3049966

Springer-Verlag US 2009 ;ISBN: 9780387782188 ;ISBN: 0387782184 ;EISBN: 0387782192 ;EISBN: 9780387782195 ;DOI: 10.1007/978-0-387-78219-5 ;OCLC: 426487487

Distributed under a Creative Commons Attribution 4.0 International License ;ISSN: 0885-8993 ;EISSN: 1941-0107 ;DOI: 10.1109/TPEL.2022.3142273

Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2021 ;Distributed under a Creative Commons Attribution 4.0 International License ;ISSN: 2644-1292 ;EISSN: 2644-1292 ;DOI: 10.1109/OJNANO.2021.3127652 ;CODEN: IOJNAY

Springer-Verlag US 2010 ;ISBN: 1441909834 ;ISBN: 9781441909831 ;ISBN: 9781489983244 ;ISBN: 1489983244 ;EISBN: 9781441909848 ;EISBN: 1441909842 ;DOI: 10.1007/978-1-4419-0984-8 ;OCLC: 647834201

Author(s) ;ISSN: 0034-6748 ;EISSN: 1089-7623 ;DOI: 10.1063/1.5001835 ;PMID: 28964213 ;CODEN: RSINAK

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