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Reports
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Reports
|
|
High Thermal Conductivity Thermosets for Composite ApplicationsAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 2 |
Material Type: Reports
|
|
Micropackaging for Mm-Wave CircuitsAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 3 |
Material Type: Reports
|
|
Study of Surface Phenomena in Ceramics by ItemApproved for public release; distribution is unlimited.Digital Resources/Online E-Resources |
| 4 |
Material Type: Reports
|
|
An Expert System for Design of Plastic Integrated Circuit Packages Against Latent Moisture Induced Defects. Phase IIAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 5 |
Material Type: Reports
|
|
Optical Interconnect Technology (OIT) Multichip Module to Multichip ModuleAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 6 |
Material Type: Reports
|
|
CALCE News: 'The Computer Aided Life Cycle Engineering Electronic Packaging Research Center', January 1991 thru June 1997APPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 7 |
Material Type: Reports
|
|
Affordable, Lightweight, Highly Conductive Polymer Composite Electronic Packaging StructuresAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 8 |
Material Type: Reports
|
|
Fundamental Studies of Electronic Packaging Materials and Structures: Surface and InterfacesApproved for public release; distribution is unlimited.Digital Resources/Online E-Resources |
| 9 |
Material Type: Reports
|
|
Properties of Polystyrene Bead Foam as an Encapsulant for Electronic PackagesAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 10 |
Material Type: Reports
|
|
|
| 11 |
Material Type: Reports
|
|
Initial Experiments on Thermal Interface Materials for Electronics PackagingApproved for public release; distribution is unlimited.Digital Resources/Online E-Resources |
| 12 |
Material Type: Reports
|
|
Packaging of Power Electronics Building BlocksAPPROVED FOR PUBLIC RELEASEDigital Resources/Online E-Resources |
| 13 |
Material Type: Reports
|
|
Design and Packaging of Fault Tolerant Optoelectronic Multiprocessor Computing SystemsApproved for public release; distribution is unlimited.Digital Resources/Online E-Resources |
| 14 |
Material Type: Reports
|
|
Process-Dependence of Properties in High Thermal Conductivity Aluminum Nitride Substrates for Electronic PackagingApproved for public release; distribution is unlimited.Digital Resources/Online E-Resources |
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Subject
- Electronic Packaging (10)
- Packaging (9)
- Electronic Equipment (6)
- Containers And Packaging (6)
- Polymers (5)
- Electrical And Electronic Equipment (5)
- Plastics (4)
- Integrated Circuits (3)
- Materials (2)
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- Interfaces (2)
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- Electronics Packaging (2)
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- Laminates And Composite Materials (2)
- Encapsulation (2)
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Databases
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| 19 Nguyen Huu Tho St. Dist.7, HCM |  |
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