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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Book
|
|
Advanced Materials for Thermal Management of Electronic PackagingSpringer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360Full text available |
| 2 |
Material Type: Book
|
|
Moisture Sensitivity of Plastic Packages of IC DevicesSpringer Science+Business Media, LLC 2010 ;ISBN: 9781441957184 ;ISBN: 1441957189 ;ISBN: 1441957197 ;ISBN: 9781441957191 ;EISBN: 1441957197 ;EISBN: 9781441957191 ;DOI: 10.1007/978-1-4419-5719-1 ;OCLC: 663096136 ;LCCallNum: TK7870.15 .M65 2010ebFull text available |
| 3 |
Material Type: Book
|
|
Materials for Advanced PackagingSpringer-Verlag US 2009 ;ISBN: 9780387782188 ;ISBN: 0387782184 ;EISBN: 0387782192 ;EISBN: 9780387782195 ;DOI: 10.1007/978-0-387-78219-5 ;OCLC: 426487487Full text available |
| 4 |
Material Type: Book
|
|
RF and Microwave Microelectronics PackagingSpringer-Verlag US 2010 ;ISBN: 1441909834 ;ISBN: 9781441909831 ;ISBN: 9781489983244 ;ISBN: 1489983244 ;EISBN: 9781441909848 ;EISBN: 1441909842 ;DOI: 10.1007/978-1-4419-0984-8 ;OCLC: 647834201Full text available |
| 5 |
Material Type: Book
|
|
Nano-Bio- Electronic, Photonic and MEMS PackagingSpringer-Verlag US 2010 ;ISBN: 9781441900395 ;ISBN: 144190039X ;ISBN: 9781489983619 ;ISBN: 1489983619 ;EISBN: 1441900403 ;EISBN: 9781441900401 ;DOI: 10.1007/978-1-4419-0040-1 ;OCLC: 663096259Full text available |
| 6 |
Material Type: Book
|
|
Lead-free SolderingSpringer-Verlag US 2007 ;ISBN: 9780387324661 ;ISBN: 0387324666 ;ISBN: 0387684220 ;ISBN: 9780387684222 ;EISBN: 9780387684222 ;EISBN: 0387684220 ;DOI: 10.1007/978-0-387-68422-2 ;OCLC: 209922663 ;LCCallNum: TK7870.15 .L42 2007ebFull text available |
| 7 |
Material Type: Book
|
|
Physical Design Essentials: ASIC Design Implementation PerspectiveSpringer-Verlag US 2007 ;ISBN: 0387366423 ;ISBN: 9780387366425 ;ISBN: 9780387461151 ;ISBN: 0387461159 ;EISBN: 9780387461151 ;EISBN: 0387461159 ;DOI: 10.1007/978-0-387-46115-1 ;OCLC: 225365478 ;LCCallNum: TK7874.6 .G65 2007ebFull text available |
| 8 |
Material Type: Book
|
|
Fuel Cell Electronics PackagingSpringer-Verlag US 2007 ;ISBN: 9780387473239 ;ISBN: 0387473238 ;EISBN: 9780387473246 ;EISBN: 0387473246 ;DOI: 10.1007/978-0-387-47324-6 ;OCLC: 186568499Full text available |
| 9 |
Material Type: Book
|
|
Leakage in Nanometer CMOS TechnologiesISBN: 9780387257372 ;ISBN: 0387257373 ;EISBN: 9780387281339 ;EISBN: 0387281339 ;OCLC: 209908125Full text available |
| 10 |
Material Type: Web Resources
|
|
Simulation-based investigation of interface delamination in plastic IC packages under temperature and moisture loadingDigital Resources/Online E-Resources |
| 11 |
Material Type: Web Resources
|
|
Template-Assisted Electrodeposition of Metallic Nanowires and their Application in Electronic PackagingDigital Resources/Online E-Resources |
| 12 |
Material Type: Book
|
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Systematische Mehrlagen-Integration hybrider HochfrequenzschaltungenISBN: 9783869552330 ;ISBN: 3869552336 ;EISBN: 3736932332 ;EISBN: 9783736932333 ;OCLC: 1003263723Full text available |
| 13 |
Material Type: Article
|
|
Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing systemDOI: 10.1109/TCPMT.2018.2859031Digital Resources/Online E-Resources |
| 14 |
Material Type: Web Resources
|
|
Advanced RF frontend technology using micromachined SiGe (ARTEMIS) :Public Final ReportDigital Resources/Online E-Resources |
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