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Material Type: Article
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Packaged Cryogenic Photon Pair Source Using an Effective Packaging Methodology for Cryogenic Integrated OpticsarXiv.org, 2024-012024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2401.02068Full text available |
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Material Type: Article
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US Microelectronics Packaging Ecosystem: Challenges and OpportunitiesarXiv.org, 2023-102023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2310.11651Full text available |
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3 |
Material Type: Article
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Unravelling metallic contaminants in complex polyimide heterostructures using deep ultraviolet spectroscopic ellipsometryarXiv.org, 2023-082023. This work is published under http://creativecommons.org/licenses/by-nc-nd/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by-nc-nd/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2308.03015Full text available |
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Material Type: Article
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From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip ProductionarXiv.org, 2023-082023. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2308.00215Full text available |
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5 |
Material Type: Article
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Tunable X-band opto-electronic synthesizer with ultralow phase noisearXiv.org, 2024-032024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2404.00136Full text available |
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6 |
Material Type: Article
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ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSIarXiv.org, 2024-022024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2306.09434Full text available |
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7 |
Material Type: Article
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Highly-efficient fiber to Si-waveguide free-form coupler for foundry-scale silicon photonicsarXiv.org, 2023-122023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2312.13329Full text available |
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8 |
Material Type: Article
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One-Dimensional Deep Image Prior for Curve Fitting of S-Parameters from Electromagnetic SolversarXiv.org, 2023-062023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2306.04001Full text available |
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9 |
Material Type: Article
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Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compoundarXiv.org, 2023-052023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2305.10582Full text available |
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10 |
Material Type: Article
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Machine learning search for stable binary Sn alloys with Na, Ca, Cu, Pd, and AgarXiv.org, 2023-102023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2306.10223Full text available |
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11 |
Material Type: Article
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Rapid Flow Behavior Modeling of Thermal Interface Materials Using Deep Neural NetworksarXiv.org, 2022-082022. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2208.04045Full text available |
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12 |
Material Type: Article
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LOCx2, a Low-latency, Low-overhead, 2 x 5.12-Gbps Transmitter ASIC for the ATLAS Liquid Argon Calorimeter Trigger UpgradearXiv.org, 2020-092020. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2009.08627Full text available |
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13 |
Material Type: Article
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LOCx2-130, a low-power, low-latency, 2 x 4.8-Gbps serializer ASIC for detector front-end readoutarXiv.org, 2020-092020. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2009.06147Full text available |
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14 |
Material Type: Article
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Microscale Morphology Driven Thermal Transport in Fiber Reinforced Polymer CompositesarXiv.org, 2024-032024. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2403.17650Full text available |
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15 |
Material Type: Article
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Laser-actuated hermetic seals for integrated atomic devicesarXiv.org, 2022-052022. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2205.10440Full text available |
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16 |
Material Type: Article
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Review Of Integrated Photonic Elastic WDM Switches For Data CentersarXiv.org, 2021-052021. This work is published under http://creativecommons.org/publicdomain/zero/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/publicdomain/zero/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2105.14934Full text available |
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17 |
Material Type: Article
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Emerging Devices and Packaging Strategies for Electronic-Photonic AI AcceleratorsarXiv.org, 2021-122021. This work is published under http://creativecommons.org/licenses/by-nc-nd/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by-nc-nd/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2112.12844Full text available |
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18 |
Material Type: Article
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A 10 Gbps Driver/Receiver ASIC and Optical Modules for Particle Physics ExperimentsarXiv.org, 2020-102020. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2010.16069Full text available |
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19 |
Material Type: Article
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A high entropy alloy as very low melting point solder for advanced electronic packagingarXiv.org, 2020-062020. This work is published under http://arxiv.org/licenses/nonexclusive-distrib/1.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://arxiv.org/licenses/nonexclusive-distrib/1.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.2006.01345Full text available |
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20 |
Material Type: Article
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274-GHz CMOS Signal Generator with an On-Chip Patch Antenna in a QFN PackagearXiv.org, 2019-062019. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;http://creativecommons.org/licenses/by/4.0 ;EISSN: 2331-8422 ;DOI: 10.48550/arxiv.1906.05117Full text available |