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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Article
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Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics PackagingProcesses, 2021-09, Vol.9 (9), p.1634 [Peer Reviewed Journal]2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2227-9717 ;EISSN: 2227-9717 ;DOI: 10.3390/pr9091634Full text available |
| 2 |
Material Type: Article
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An Overview of Recent Development of the Gap-Waveguide Technology for mmWave and sub-THz ApplicationsIEEE access, 2023-01, Vol.11, p.1-1 [Peer Reviewed Journal]Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2023 ;ISSN: 2169-3536 ;EISSN: 2169-3536 ;DOI: 10.1109/ACCESS.2023.3293739 ;CODEN: IAECCGFull text available |
| 3 |
Material Type: Article
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PEDOT: PSS Thermoelectric Generators Printed on Paper SubstratesJournal of low power electronics and applications, 2019-06, Vol.9 (2), p.14 [Peer Reviewed Journal]2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2079-9268 ;EISSN: 2079-9268 ;DOI: 10.3390/jlpea9020014Full text available |
| 4 |
Material Type: Thesises (postgraduate)
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Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic PackagingISBN: 9789175972046 ;ISBN: 9175972042Digital Resources/Online E-Resources |
| 5 |
Material Type: Conference Proceeding
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Dissipation Loop for Shoot-Through Faults in HVDC Converter Cells2018 INTERNATIONAL POWER ELECTRONICS CONFERENCE (IPEC-NIIGATA 2018 -ECCE ASIA), 2018, p.3292ISBN: 4886864058 ;ISBN: 9784886864055 ;DOI: 10.23919/IPEC.2018.8507546Digital Resources/Online E-Resources |
| 6 |
Material Type: Conference Proceeding
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Thermal-Aware Test Scheduling for Core-based SoC in an Abort-on-First-Fail Test Environment12th EUROMICRO Conference on Digital System Design (DSD), Patras, Greece, August 27-29, 2009., 2009, p.239ISBN: 9780769537825 ;ISBN: 0769537820 ;DOI: 10.1109/DSD.2009.136Digital Resources/Online E-Resources |
| 7 |
Material Type: Article
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Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder jointsMicroelectronics and reliability, 2019-02, Vol.93, p.61 [Peer Reviewed Journal]ISSN: 1872-941X ;ISSN: 0026-2714 ;EISSN: 1872-941X ;DOI: 10.1016/j.microrel.2019.01.006Digital Resources/Online E-Resources |
| 8 |
Material Type: Article
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Factorized Geometrical Autofocus for Synthetic Aperture Radar ProcessingIEEE transactions on geoscience and remote sensing, 2014-10, Vol.52 (10), p.6674 [Peer Reviewed Journal]ISSN: 1558-0644 ;ISSN: 0196-2892 ;EISSN: 1558-0644 ;DOI: 10.1109/tgrs.2014.2300347Digital Resources/Online E-Resources |
| 9 |
Material Type: Article
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Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wiresJournal of micromechanics and microengineering, 2012-10, Vol.22 (10), p.105001-9 [Peer Reviewed Journal]2012 IOP Publishing Ltd ;2015 INIST-CNRS ;ISSN: 0960-1317 ;ISSN: 1361-6439 ;EISSN: 1361-6439 ;DOI: 10.1088/0960-1317/22/10/105001 ;CODEN: JMMIEZFull text available |
| 10 |
Material Type: Conference Proceeding
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Low temperature co-fired ceramic package for lab-on-CMOS applied in cell viability monitoringEurosensors 2015, 2015, p.1079 [Peer Reviewed Journal]DOI: 10.1016/j.proeng.2015.08.769Digital Resources/Online E-Resources |
| 11 |
Material Type: Thesises (postgraduate)
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Multiphysics Characterization of SiC Power ModulesISBN: 9789177298182 ;ISBN: 9177298187Digital Resources/Online E-Resources |
| 12 |
Material Type: Thesises (postgraduate)
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Carbon Nanotube Based Interconnect Material for Electronic ApplicationsDigital Resources/Online E-Resources |
| 13 |
Material Type: Thesises (postgraduate)
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Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics PackagingDigital Resources/Online E-Resources |
| 14 |
Material Type: Conference Proceeding
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Narrow footprint copper sealing rings for low-temperature hermetic wafer-level packagingTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, p.423ISBN: 1538627310 ;ISBN: 9781538627310 ;DOI: 10.1109/TRANSDUCERS.2017.7994077Digital Resources/Online E-Resources |
| 15 |
Material Type: Conference Proceeding
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Stress-minimized packaging of inertial sensors using wire bonding2013 Transducers & Eurosensors XXVII, 2013, p.1962ISBN: 9781467359832 ;ISBN: 1467359831 ;DOI: 10.1109/Transducers.2013.6627179Digital Resources/Online E-Resources |
| 16 |
Material Type: Conference Proceeding
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Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-CouplingMEMS 2010, 2010, p.480ISBN: 1424457645 ;ISBN: 9781424457649 ;DOI: 10.1109/MEMSYS.2010.5442460Digital Resources/Online E-Resources |
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