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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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| 1 |
Material Type: Article
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Study on thermal conductivity of micron BN-nano SiO2 combined modified epoxy resin compositesJournal of physics. Conference series, 2024-03, Vol.2720 (1), p.012009 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2720/1/012009Full text available |
| 2 |
Material Type: Article
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Study on sintering properties of aluminum oxide nano-powder for electronics packagingJournal of physics. Conference series, 2024-02, Vol.2713 (1), p.012004 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2713/1/012004Full text available |
| 3 |
Material Type: Article
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Bond graph model study of the jet dispensing valveJournal of physics. Conference series, 2023-12, Vol.2674 (1), p.12001 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2674/1/012001Full text available |
| 4 |
Material Type: Article
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Reliability issues of lead-free solder joints in electronic devicesScience and technology of advanced materials, 2019-12, Vol.20 (1), p.876-901 [Peer Reviewed Journal]2019 The Author(s). Published by National Institute for Materials Science in partnership with Informa UK Limited, trading as Taylor & Francis Group. 2019 ;2019 The Author(s). Published by National Institute for Materials Science in partnership with Informa UK Limited, trading as Taylor & Francis Group. This work is licensed under the Creative Commons Attribution License http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2019 The Author(s). Published by National Institute for Materials Science in partnership with Informa UK Limited, trading as Taylor & Francis Group. 2019 The Author(s) ;ISSN: 1468-6996 ;EISSN: 1878-5514 ;DOI: 10.1080/14686996.2019.1640072 ;PMID: 31528239Full text available |
| 5 |
Material Type: Article
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The Simulation Research of Uniform Droplets Transformation Process-from Drop on Demand to Continue Ink Jet TechnologyJournal of physics. Conference series, 2023-10, Vol.2610 (1), p.12014 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2610/1/012014Full text available |
| 6 |
Material Type: Article
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Investigation on Rheological Characterization of Isotropic Conductive AdhesivesJournal of physics. Conference series, 2023-08, Vol.2578 (1), p.12021 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2578/1/012021Full text available |
| 7 |
Material Type: Article
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Microfluidic enabled flexible sensors based on self-diffusion MWCNTs dispersionJournal of physics. Conference series, 2024-04, Vol.2740 (1), p.012055 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2740/1/012055Full text available |
| 8 |
Material Type: Article
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Thermal-Mechanical Property of High Aspect Ratio TSV in Advanced IC integration and PackagingJournal of physics. Conference series, 2024-04, Vol.2740 (1), p.012054 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2740/1/012054Full text available |
| 9 |
Material Type: Article
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Structure and properties of Sn-Cu lead-free solders in electronics packagingScience and technology of advanced materials, 2019-12, Vol.20 (1), p.421-444 [Peer Reviewed Journal]2019 The Author(s). Published by National Institute for Materials Science in partnership with Informa UK Limited, trading as Taylor & Francis Group. 2019 ;2019 The Author(s). Published by National Institute for Materials Science in partnership with Informa UK Limited, trading as Taylor & Francis Group. This work is licensed under the Creative Commons Attribution License http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2019 The Author(s). Published by National Institute for Materials Science in partnership with Informa UK Limited, trading as Taylor & Francis Group. 2019 The Author(s) ;ISSN: 1468-6996 ;EISSN: 1878-5514 ;DOI: 10.1080/14686996.2019.1591168 ;PMID: 31489052Full text available |
| 10 |
Material Type: Article
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Effects of Diamond Content on the Thermal Conductivity of Copper Matrix Composite Materials Prepared by Cold SprayingJournal of physics. Conference series, 2024-01, Vol.2694 (1), p.12029 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2694/1/012029Full text available |
| 11 |
Material Type: Article
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Computer aided design and simulation of the amplification structure of 3D electronic packaging printerJournal of physics. Conference series, 2020-10, Vol.1650 (3), p.32160 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;2020. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/1650/3/032160Full text available |
| 12 |
Material Type: Article
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Mixed Assembly of Lead-free Solder Joint: A Short ReviewJournal of physics. Conference series, 2022-01, Vol.2169 (1), p.12039 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2169/1/012039Full text available |
| 13 |
Material Type: Article
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Welding defect signal extraction technology based on GAMP-SBL algorithmJournal of physics. Conference series, 2022-05, Vol.2221 (1), p.12042 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2221/1/012042Full text available |
| 14 |
Material Type: Article
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International Conference on Electronic and Advanced Materials 2021Journal of physics. Conference series, 2022-01, Vol.2169 (1), p.11001 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2169/1/011001Full text available |
| 15 |
Material Type: Article
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Contributions to an additive method for manufacturing solderless assembly for electronicsJournal of physics. Conference series, 2022-09, Vol.2339 (1), p.12029 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2339/1/012029Full text available |
| 16 |
Material Type: Article
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Study on high thermal conductivity insulation materials for wide temperature range applicationsJournal of physics. Conference series, 2022-09, Vol.2342 (1), p.12008 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2342/1/012008Full text available |
| 17 |
Material Type: Article
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Effect of sintering process on microstructure and properties of Al–Si alloy made by powder metallurgy for electronic packaging applicationMaterials research express, 2023-06, Vol.10 (6), p.66506 [Peer Reviewed Journal]2023 The Author(s). Published by IOP Publishing Ltd ;2023 The Author(s). Published by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2053-1591 ;EISSN: 2053-1591 ;DOI: 10.1088/2053-1591/acd990Full text available |
| 18 |
Material Type: Article
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Angle-resolved Micro-Raman, a prospectively automatic method of stress measurement for electronic packaging of semiconductorJournal of physics. Conference series, 2021-03, Vol.1820 (1), p.12046 [Peer Reviewed Journal]2021. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/1820/1/012046Full text available |
| 19 |
Material Type: Article
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A study on the degassing mechanism of Pb-based alloy under ultrasonic treatmentJournal of physics. Conference series, 2022-02, Vol.2206 (1), p.12033 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2206/1/012033Full text available |
| 20 |
Material Type: Article
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Microstructure Evolution and Interfacial Reaction of Cu/SAC305/Cu and Co-P/SAC305/Cu Solder Joints under High Current DensityJournal of physics. Conference series, 2023-01, Vol.2419 (1), p.12009 [Peer Reviewed Journal]Published under licence by IOP Publishing Ltd ;Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2419/1/012009Full text available |
Results 1 - 20 of 91 for All Library Resources
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