Results 1 - 20 of 297,992 for All Library Resources
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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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Material Type: Article
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Applications and Impacts of Nanoscale Thermal Transport in Electronics PackagingJournal of electronic packaging, 2021-06, Vol.143 (2) [Peer Reviewed Journal]ISSN: 1043-7398 ;EISSN: 1528-9044 ;DOI: 10.1115/1.4049293Full text available |
| 2 |
Material Type: Book
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Materials for High-density Electronic Packaging and InterconnectionISBN0-309-04233-X;ISBN9786610212514;ISBN1-280-21251-9;ISBN0-309-53669-3;ISBN0-585-14395-1Digital Resources/Online E-Resources |
| 3 |
Material Type: Book
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Advanced Materials for Thermal Management of Electronic PackagingSpringer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360Full text available |
| 4 |
Material Type: Journal
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| 5 |
Material Type: Article
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Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics PackagingJournal of electronic packaging, 2021-03, Vol.143 (1) [Peer Reviewed Journal]ISSN: 1043-7398 ;EISSN: 1528-9044 ;DOI: 10.1115/1.4047414Full text available |
| 6 |
Material Type: Article
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Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–IndustrySustainability, 2022-12, Vol.14 (23), p.15730 [Peer Reviewed Journal]COPYRIGHT 2022 MDPI AG ;2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2071-1050 ;EISSN: 2071-1050 ;DOI: 10.3390/su142315730Full text available |
| 7 |
Material Type: Journal
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Transactions of The Japan Institute of Electronics PackagingISSN1883-3365Digital Resources/Online E-Resources |
| 8 |
Material Type: Article
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Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic PackagingJournal of electronic materials, 2015-10, Vol.44 (10), p.3973-3984 [Peer Reviewed Journal]The Minerals, Metals & Materials Society 2015 ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-015-3842-1 ;CODEN: JECMA5Full text available |
| 9 |
Material Type: Book
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and TestingISBN: 0470827807 ;ISBN: 9780470827802 ;ISBN: 9780470827819 ;ISBN: 0470827815 ;ISBN: 0470827823 ;ISBN: 9780470827826 ;EISBN: 9780470827819 ;EISBN: 0470827815 ;EISBN: 0470828412 ;EISBN: 9780470828410 ;DOI: 10.1002/9780470827826 ;OCLC: 756280855 ;LCCallNum: TK7870.15Full text available |
| 10 |
Material Type: Article
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Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packagingJournal of materials science. Materials in electronics, 2017-07, Vol.28 (14), p.10230-10244 [Peer Reviewed Journal]Springer Science+Business Media New York 2017 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2017). All Rights Reserved. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-017-6790-0Full text available |
| 11 |
Material Type: Article
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Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packagingJournal of Materials Science. Materials in Electronics, 2016-12, Vol.27 (12), p.12729-12763 [Peer Reviewed Journal]Springer Science+Business Media New York 2016 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, 2016. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-016-5407-3Full text available |
| 12 |
Material Type: Article
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Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packagingJournal of materials science. Materials in electronics, 2017-06, Vol.28 (11), p.7827-7833 [Peer Reviewed Journal]Springer Science+Business Media New York 2017 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, 2017. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-017-6479-4Full text available |
| 13 |
Material Type: Article
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A Review on Laser Processing in Electronic and MEMS PackagingJournal of electronic packaging, 2017-09, Vol.139 (3) [Peer Reviewed Journal]ISSN: 1043-7398 ;EISSN: 1528-9044 ;DOI: 10.1115/1.4036239Full text available |
| 14 |
Material Type: Article
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Effect of minor scandium addition on the microstructure and properties of Al–50Si alloys for electronic packagingJournal of materials science. Materials in electronics, 2019-12, Vol.30 (23), p.20770-20777 [Peer Reviewed Journal]Springer Science+Business Media, LLC, part of Springer Nature 2019 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2019). All Rights Reserved. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-019-02444-0Full text available |
| 15 |
Material Type: Article
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CoSn[sub.3] Intermetallic Nanoparticles for Electronic PackagingNanomaterials (Basel, Switzerland), 2022-11, Vol.12 (22) [Peer Reviewed Journal]COPYRIGHT 2022 MDPI AG ;ISSN: 2079-4991 ;EISSN: 2079-4991 ;DOI: 10.3390/nano12224083Full text available |
| 16 |
Material Type: Article
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Low-Dielectric Constant Nanoporous Epoxy for Electronic PackagingJournal of electronic packaging, 2020-03, Vol.142 (1) [Peer Reviewed Journal]ISSN: 1043-7398 ;EISSN: 1528-9044 ;DOI: 10.1115/1.4044626Full text available |
| 17 |
Material Type: Article
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Microstructures and properties of Ag–Cu–Ti–In composite fillers for electronic packaging applicationsJournal of materials science. Materials in electronics, 2019-06, Vol.30 (12), p.11520-11528 [Peer Reviewed Journal]Springer Science+Business Media, LLC, part of Springer Nature 2019 ;Journal of Materials Science: Materials in Electronics is a copyright of Springer, (2019). All Rights Reserved. ;ISSN: 0957-4522 ;EISSN: 1573-482X ;DOI: 10.1007/s10854-019-01507-6Full text available |
| 18 |
Material Type: Article
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Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape StudyJournal of electronic packaging, 2016-06, Vol.138 (2) [Peer Reviewed Journal]ISSN: 1043-7398 ;EISSN: 1528-9044 ;DOI: 10.1115/1.4033069Full text available |
| 19 |
Material Type: Article
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Application of Alumina-Based Ceramic Paste for High-Temperature Electronics PackagingJournal of electronic packaging, 2021-06, Vol.143 (2) [Peer Reviewed Journal]ISSN: 1043-7398 ;EISSN: 1528-9044 ;DOI: 10.1115/1.4049292Full text available |
| 20 |
Material Type: Article
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Effect of sintering process on microstructure and properties of Al–Si alloy made by powder metallurgy for electronic packaging applicationMaterials research express, 2023-06, Vol.10 (6), p.66506 [Peer Reviewed Journal]2023 The Author(s). Published by IOP Publishing Ltd ;2023 The Author(s). Published by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 2053-1591 ;EISSN: 2053-1591 ;DOI: 10.1088/2053-1591/acd990Full text available |
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