Results 1 - 20 of 21 for All Library Resources
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Conference Proceedings
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Conference Proceeding
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Solutions to improve the attraction of Hai Phong public transport systemE3S web of conferences, 2023, Vol.403, p.07014 [Peer Reviewed Journal]EISSN: 2267-1242 ;DOI: 10.1051/e3sconf/202340307014Full text available |
| 2 |
Material Type: Conference Proceeding
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Determinants of students’ behavior in using light rail transit in HanoiE3S web of conferences, 2023, Vol.403, p.07001 [Peer Reviewed Journal]EISSN: 2267-1242 ;DOI: 10.1051/e3sconf/202340307001Full text available |
| 3 |
Material Type: Conference Proceeding
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Using Remote sensing and GIS to survey surface water in Hanoi, VietnamE3S web of conferences, 2023, Vol.403, p.06003 [Peer Reviewed Journal]EISSN: 2267-1242 ;DOI: 10.1051/e3sconf/202340306003Full text available |
| 4 |
Material Type: Conference Proceeding
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Design, Fabrication and Measurement of FOWLP-based Series-Fed Antennas for 6G D-Band MIMO ApplicationsThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2022Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 ;DOI: 10.1109/ESTC55720.2022.9939481Digital Resources/Online E-Resources |
| 5 |
Material Type: Conference Proceeding
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Sub-TeraHertz Modular Array Layout Optimization Under Fabrication ConstraintsThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2022Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 ;DOI: 10.1109/EuCNC/6GSummit54941.2022.9815808Digital Resources/Online E-Resources |
| 6 |
Material Type: Conference Proceeding
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PCB Embedding Technology for 5G mmWave ApplicationsThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2022Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 ;DOI: 10.1109/ESTC55720.2022.9939446Digital Resources/Online E-Resources |
| 7 |
Material Type: Conference Proceeding
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Physical Layer Security for UAV-Based Full-Duplex Relay NOMA SystemThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2022Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 ;DOI: 10.1109/ATC55345.2022.9943050Digital Resources/Online E-Resources |
| 8 |
Material Type: Conference Proceeding
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Compact Wideband Antenna-in-Package Based on PCB Technology for 39 GHz 5G mmWave ApplicationsThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2022Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022Digital Resources/Online E-Resources |
| 9 |
Material Type: Conference Proceeding
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Effects of Glob Top on mmWave Bond Wire AntennasThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2018, p.807Digital Resources/Online E-Resources |
| 10 |
Material Type: Conference Proceeding
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Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennasThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2018, p.5Digital Resources/Online E-Resources |
| 11 |
Material Type: Conference Proceeding
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Double-wired bond wire antennasThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2018, p.216Digital Resources/Online E-Resources |
| 12 |
Material Type: Conference Proceeding
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A comparative analysis of 5G mmWave antenna arrays on different substrate technolgiesThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2018, p.222Digital Resources/Online E-Resources |
| 13 |
Material Type: Conference Proceeding
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Repeated Index Modulation with Coordinate Interleaved OFDMThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2018, p.114Digital Resources/Online E-Resources |
| 14 |
Material Type: Conference Proceeding
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Can Bond Wires really be used as Antennas?The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2018, p.1Digital Resources/Online E-Resources |
| 15 |
Material Type: Conference Proceeding
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Repeated index modulation for OFDM with space and frequency diversityThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2017, p.97Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2017Digital Resources/Online E-Resources |
| 16 |
Material Type: Conference Proceeding
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Enhanced Spread Spectrum OFDM-IM with Rotated Zadoff-Chu SequencesThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2018, p.189Digital Resources/Online E-Resources |
| 17 |
Material Type: Conference Proceeding
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The multi‐functionality of extensive cattle livestock and its importance for agricultural systems in northern highlands of VietnamDistributed under a Creative Commons Attribution 4.0 International LicenseDigital Resources/Online E-Resources |
| 18 |
Material Type: Conference Proceeding
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Multiple criteria model for evaluation and selection of outsourcing service countries: A case study in the East and Southeast AsiaThe Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, 2013, p.887Digital Resources/Online E-Resources |
| 19 |
Material Type: Conference Proceeding
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Modèles théoriques et numériques pour la modélisation avancée de plaques compositesDistributed under a Creative Commons Attribution 4.0 International LicenseDigital Resources/Online E-Resources |
| 20 |
Material Type: Conference Proceeding
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Éléments de Plaque pour Structures Sandwich avec Âme Viscoélastique basés sur la Sublaminate Generalized Unified FormulationDistributed under a Creative Commons Attribution 4.0 International LicenseDigital Resources/Online E-Resources |
Results 1 - 20 of 21 for All Library Resources
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- Antennas (8)
- Millimeter Waves (7)
- Antenna Arrays (5)
- Patch Antennas (4)
- Engineering, Electrical & Electronic (3)
- Orthogonal Frequency Division Multiplexing (3)
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- Technology (3)
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