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Evaluating the flow processes in ultrafine-grained materials at elevated temperatures

Materials research (São Carlos, São Paulo, Brazil), 2013-06, Vol.16 (3), p.565-570 [Peer Reviewed Journal]

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License. ;ISSN: 1516-1439 ;ISSN: 1980-5373 ;EISSN: 1980-5373 ;DOI: 10.1590/S1516-14392013005000023

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Title:
Evaluating the flow processes in ultrafine-grained materials at elevated temperatures
Author: Kawasaki, Megumi ; Langdon, Terence G.
Subjects: Creep (materials) ; deformation mechanism maps ; Deformation mechanisms ; ENGINEERING, CHEMICAL ; Equal channel angular pressing ; flow processes ; Grain size ; High temperature ; high-pressure torsion ; MATERIALS SCIENCE, MULTIDISCIPLINARY ; METALLURGY & METALLURGICAL ENGINEERING ; Plotting ; superplasticity ; Torsion
Is Part Of: Materials research (São Carlos, São Paulo, Brazil), 2013-06, Vol.16 (3), p.565-570
Description: When polycrystalline materials are tested in tension at elevated temperatures, the flow mechanisms depend upon various parameters including the temperature of testing, the applied stress and the material grain size. The plotting of deformation mechanism maps is a procedure used widely in displaying and interpreting the creep properties of conventional coarse-grained metals but there have been few attempts to date to use this same procedure for ultrafine-grained and nanocrystalline materials produced through the application of severe plastic deformation (SPD). This report examines the potential for using deformation mechanism mapping for materials processed by SPD and presents examples for materials processed using equal-channel angular pressing and high-pressure torsion.
Publisher: ABM, ABC, ABPol
Language: English;Portuguese;Spanish
Identifier: ISSN: 1516-1439
ISSN: 1980-5373
EISSN: 1980-5373
DOI: 10.1590/S1516-14392013005000023
Source: SciELO
GFMER Free Medical Journals
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Evaluating the flow processes in ultrafine-grained materials at elevated temperatures

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License. ;ISSN: 1516-1439 ;ISSN: 1980-5373 ;EISSN: 1980-5373 ;DOI: 10.1590/S1516-14392013005000023

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