Wheatstone bridge sensor arrays in foil by robust μ-via technology combining femtosecond-laser drilling and pulsed electrodeposition
Micro and Nano Engineering, 2024-06, Vol.23, p.100252, Article 100252 [Peer Reviewed Journal]2024 The Authors ;ISSN: 2590-0072 ;EISSN: 2590-0072 ;DOI: 10.1016/j.mne.2024.100252
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