skip to main content
Guest
My Research
My Account
Sign out
Sign in
This feature requires javascript
Library Search
Find Databases
Browse Search
E-Journals A-Z
E-Books A-Z
Citation Linker
Help
Language:
English
Vietnamese
This feature required javascript
This feature requires javascript
Primo Search
All Library Resources
All
Course Materials
Course Materials
Search For:
Clear Search Box
Search in:
All Library Resources
Or hit Enter to replace search target
Or select another collection:
Search in:
All Library Resources
Search in:
Print Resources
Search in:
Digital Resources
Search in:
Online E-Resources
Advanced Search
Browse Search
This feature requires javascript
Search Limited to:
Search Limited to:
Resource type
criteria input
anywhere in the record
in the title
as author/creator
in subject
Full Text
ISBN
ISSN
TOC
Keyword
Field
Show Results with:
in the title
Show Results with:
anywhere in the record
in the title
as author/creator
in subject
Full Text
ISBN
ISSN
TOC
Keyword
Field
Show Results with:
criteria input
that contain my query words
with my exact phrase
starts with
Show Results with:
Search type Index
criteria input
AND
OR
NOT
This feature requires javascript
Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks
Journal of electronic packaging, 2020-06, Vol.142 (2)
[Peer Reviewed Journal]
ISSN: 1043-7398 ;EISSN: 1528-9044 ;DOI: 10.1115/1.4046557
Full text available
Citations
Cited by
View Online
Details
Recommendations
Reviews
Times Cited
External Links
This feature requires javascript
Actions
Add to My Research
Remove from My Research
E-mail
Print
Permalink
Citation
EasyBib
EndNote
RefWorks
Delicious
Export RIS
Export BibTeX
This feature requires javascript
Title:
Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks
Author:
Akin, Meriem
;
Blackburn, Jennifer
;
Pratt, Autumn
;
Dietzel, Andreas
Is Part Of:
Journal of electronic packaging, 2020-06, Vol.142 (2)
Description:
With the increase in the new development of paper electronics, there is a great demand for paper-compatible and reliable electrical joining techniques. In this work, we particularly addressed the interconnecting of multilayers of paper-based magneto-electronics. We deployed three room-temperature electrical joining techniques: (i) through-paper via, (ii) mechanical caulking, and (iii) collapsible daisy chain to fabricate an anisotropic magnetoresistive five-layer thin film sensor stack for planar rotary motion sensing. We studied the interplay between the electrical joining technique and the sensor characteristics such as magnetoresistive sensitivity and asymmetries in the sensor signal within the magnetic field strength domain. Despite process complexity and the precision limitations of manual machining and positioning, deployed in this work, the sensor stacks prepared by the through-paper via technique exhibited the closest uniformity in the magnetization planes across the stack, and hence the highest cumulative magnetoresistive sensitivity and lowest unfavorable asymmetries. Last, using peeling tests, we verified the mechanical reliability of the interconnects prepared by the through-paper via and collapsible daisy chain techniques.
Publisher:
ASME
Language:
English
Identifier:
ISSN: 1043-7398
EISSN: 1528-9044
DOI: 10.1115/1.4046557
Source:
Alma/SFX Local Collection
This feature requires javascript
This feature requires javascript
Back to results list
This feature requires javascript
This feature requires javascript
Searching Remote Databases, Please Wait
Searching for
in
scope:(TDTS),scope:(SFX),scope:(TDT),scope:(SEN),primo_central_multiple_fe
Show me what you have so far
This feature requires javascript
This feature requires javascript