Numerical Homogenization of Multi-Layered Corrugated Cardboard with Creasing or Perforation
Materials, 2021-07, Vol.14 (14), p.3786 [Peer Reviewed Journal]2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;2021 by the authors. 2021 ;ISSN: 1996-1944 ;EISSN: 1996-1944 ;DOI: 10.3390/ma14143786 ;PMID: 34300705
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