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11 - Non-destructive evaluation (NDE) of composites: detecting delamination defects using mechanical impedance, ultrasonic and infrared thermographic techniques

Non-destructive evaluation (NDE) of polymer matrix composites, 2013, p.279,306e-305,308e

2013 Woodhead Publishing Limited ;ISBN: 0857093444 ;ISBN: 9780857093448 ;ISBN: 9780857093554 ;ISBN: 085709355X ;DOI: 10.1533/9780857093554.2.279

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  • Title:
    11 - Non-destructive evaluation (NDE) of composites: detecting delamination defects using mechanical impedance, ultrasonic and infrared thermographic techniques
  • Author: Wong, B.S.
  • Subjects: defect size and location detectability ; large area inspection ; mechanical impedance inspection of disbonds ; thermographic inspection ; ultrasonic inspection of delaminations
  • Is Part Of: Non-destructive evaluation (NDE) of polymer matrix composites, 2013, p.279,306e-305,308e
  • Description: The non-destructive tests in this chapter are focused on delamination defect detection in solid plate composites and disbonds in honeycomb structures. The following topics are presented: mechanical impedance inspection of disbonds, ultrasonic inspection of delaminations and thermographic inspection of delaminations. These three techniques are described in detail individually, and generally major advantages of each are: mechanical impedance inspection does not require a liquid couplant between the probe and specimen, ultrasonics is usually considered to be the most sensitive technique and thermographic can test large areas quickly. A comparison will be made between the techniques and the following factors will be discussed: sensitivity in terms of defect size detectable, ability to size a defect and determine its shape, ability to locate the position and depth of a defect and ability to test a large area quickly.
  • Publisher: Elsevier Ltd
  • Language: English
  • Identifier: ISBN: 0857093444
    ISBN: 9780857093448
    ISBN: 9780857093554
    ISBN: 085709355X
    DOI: 10.1533/9780857093554.2.279
  • Source: Ebook Central Academic Complete
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