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Dielectric strength of insulating material in LN2 with thermally induced bubbles

Journal of physics. Conference series, 2020-06, Vol.1559 (1) [Peer Reviewed Journal]

Published under licence by IOP Publishing Ltd ;2020. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/1559/1/012087

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  • Title:
    Dielectric strength of insulating material in LN2 with thermally induced bubbles
  • Author: Gromoll, D ; Schumacher, R ; Humpert, C
  • Subjects: Bubbles ; Dielectric strength ; Equipment costs ; Film boiling ; High temperature ; Insulation ; Liquid nitrogen ; Nucleate boiling ; Porous materials ; Superconducting tapes ; Superconductors
  • Is Part Of: Journal of physics. Conference series, 2020-06, Vol.1559 (1)
  • Description: To realize a reliable and cost-effective application of high-temperature superconductive (HTS) equipment at high-voltage (HV) levels, the influence of thermally induced gas bubbles on the dielectric strength of different solid insulating materials in liquid nitrogen (LN2) was investigated. A heatable copper tape electrode arrangement was developed simulating HTS tapes with insulation in between. AC breakdown measurements were performed without and with forced boiling on insulating papers, polypropylene laminated paper (PPLP) and polyimide (PI) films. Under nucleate boiling the influence of bubbles on the dielectric strength of all materials was not significant. However under film boiling the dielectric strength of the insulating papers decreased to a level comparable to their dielectric strength in air, demonstrating the insufficient impregnation of porous materials under film boiling. For PI there was no degradation at all. PPLP retained about 70% of its basic dielectric strength in LN2.
  • Publisher: Bristol: IOP Publishing
  • Language: English
  • Identifier: ISSN: 1742-6588
    EISSN: 1742-6596
    DOI: 10.1088/1742-6596/1559/1/012087
  • Source: Freely Accessible Journals
    IOPscience (Open Access)
    Institute of Physics Open Access Journal Titles
    ProQuest Central
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