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Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

IEEE access, 2022-01, Vol.10, p.19242-19253 [Peer Reviewed Journal]

Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 ;ISSN: 2169-3536 ;EISSN: 2169-3536 ;DOI: 10.1109/ACCESS.2022.3151356 ;CODEN: IAECCG

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Title:
Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors
Author: Stoukatch, Serguei ; Fagnard, Jean-Francois ; Dupont, Francois ; Laurent, Philippe ; Debliquy, Marc ; Redoute, Jean-Michel
Subjects: Adhesive strength ; Assembly ; chemical sensors ; Computer Science (all) ; Electrical & electronics engineering ; Electronic Packaging ; Electronic packaging thermal management ; Electronic packaging thermal managements ; Electronics packaging ; Engineering (all) ; Engineering, computing & technology ; Finite element method ; Gas detectors ; Gas sensors ; General Computer Science ; General Engineering ; General Materials Science ; Heat conductivity ; Heat transfer ; Heating system ; Heating systems ; Ingénierie électrique & électronique ; Ingénierie, informatique & technologie ; Low cost ; Low temperature ; Low thermal conductivity ; Low-costs ; Materials Science (all) ; Metal oxide sensors ; Metal oxides ; Metal-oxides gas sensors ; Microassemblies ; microassembly ; microsensors ; Packaging ; Power consumption ; Power demand ; Power demands ; Sensors ; Temperature sensors ; Thermal conductivity ; Three dimensional models ; Xerogels
Is Part Of: IEEE access, 2022-01, Vol.10, p.19242-19253
Description: Metal-oxide (MOX) gas sensors commonly rely on custom packaging solution. With an ever-increasing demand for MOX gas sensors, there is a clear need for a low cost, compact and high-performance package. During normal operation, MOX sensors are heated up to a temperature in the typical range of 200-300°C. However, the generated heat must not damage or degrade any other part of the assembly. Using 3D finite elements modelling, we developed an optimal package configuration. To thermally insulate the assembly from the heated MOX sensor we have developed in-house a low thermal conductivity xerogel-epoxy composite with 22.7% by weight xerogel and a thermal conductivity of 107.9 mW m −1 K −1 which is a reduction exceeding 30% compared to commercially available epoxy. Based on the low thermal conductivity xerogel-epoxy composite, we have developed a novel packaging approach that can suit the large family of MOX sensors. The developed alternative packaging solution includes a small number of assembly steps and uses standard processes and techniques. The assembled MOX sensor is low cost and has a low power consumption, while all thermally sensitive assembly parts remain at low temperature during the system's lifetime.
Publisher: Piscataway: IEEE
Language: English
Identifier: ISSN: 2169-3536
EISSN: 2169-3536
DOI: 10.1109/ACCESS.2022.3151356
CODEN: IAECCG
Source: IEEE Open Access Journals
DOAJ Directory of Open Access Journals

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Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022 ;ISSN: 2169-3536 ;EISSN: 2169-3536 ;DOI: 10.1109/ACCESS.2022.3151356 ;CODEN: IAECCG

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