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Advanced Materials for Thermal Management of Electronic Packaging

Springer Science+Business Media, LLC 2011 ;ISSN: 1437-0387 ;ISBN: 9781441977595 ;ISBN: 1441977597 ;ISBN: 9781441977588 ;ISBN: 1441977589 ;EISBN: 9781441977595 ;EISBN: 1441977597 ;DOI: 10.1007/978-1-4419-7759-5 ;OCLC: 701369360

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  • Title:
    Advanced Materials for Thermal Management of Electronic Packaging
  • Author: Tong, Xingcun Colin
  • Subjects: Electronic apparatus and appliances ; Electronic Circuits and Devices ; Electronic packaging ; Electronics and Microelectronics, Instrumentation ; Engineering ; Engineering Thermodynamics, Heat and Mass Transfer ; Materials ; Microelectronic packaging ; Military & nautical engineering ; Optical and Electronic Materials ; Physics
  • Description: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
  • Publisher: New York, NY: Springer Nature
  • Creation Date: 2011
  • Format: 632
  • Language: English;German
  • Identifier: ISSN: 1437-0387
    ISBN: 9781441977595
    ISBN: 1441977597
    ISBN: 9781441977588
    ISBN: 1441977589
    EISBN: 9781441977595
    EISBN: 1441977597
    DOI: 10.1007/978-1-4419-7759-5
    OCLC: 701369360
  • Source: Alma/SFX Local Collection
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