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COVER FILM
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Title:
COVER FILM
Author:
NAKAMICHI Aki
;
SUZUKI Takato
Subjects:
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
;
CHEMISTRY
;
COMPOSITIONS BASED THEREON
;
GENERAL PROCESSES OF COMPOUNDING
;
LAYERED PRODUCTS
;
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
;
METALLURGY
;
ORGANIC MACROMOLECULAR COMPOUNDS
;
PERFORMING OPERATIONS
;
THEIR PREPARATION OR CHEMICAL WORKING-UP
;
TRANSPORTING
;
WORKING-UP
Description:
The present invention addresses the problem of providing a cover film having superior adhesion to a substrate when a bonded body of the cover film and the substrate is stored for a long period. The cover film according to the present invention comprises a support and a polymer layer containing a polymer, in which the support comprises cellulose triacetate derived from a wood pulp, and the polymer layer satisfying the following requirement 1. Requirement 1: the residual ratio of the polymer layer before and after the immersion of the polymer layer detached from the cover film in xylene at 25°C is 10 to 50% by mass. La présente invention aborde le problème de la fourniture d'un film de couverture ayant une adhérence supérieure à un substrat lorsqu'un corps lié du film de couverture et du substrat est stocké pendant une longue période. Le film de couverture selon la présente invention comprend un support et une couche de polymère contenant un polymère, le support comprenant du triacétate de cellulose dérivé d'une pâte de bois et la couche de polymère satisfaisant l'exigence 1 suivante. Exigence 1 : le rapport résiduel de la couche de polymère avant et après l'immersion de la couche de polymère détachée du film de couverture dans du xylène à 25 °C est de 10 à 50 % en masse. 本発明は、カバーフィルムと基材との貼合体を長期保管した際における、基材との密着性がより優れるカバーフィルムを提供することを課題とする。 本発明のカバーフィルムは、支持体と、ポリマーを含むポリマー層とを有し、上記支持体が、木材パルプ由来のセルローストリアセテートを含み、上記ポリマー層が以下の要件1を満たす、カバーフィルムである。要件1:上記カバーフィルムから剥離したポリマー層を25℃のキシレンに浸漬した前後における、ポリマー層の残存率が、10~50質量%である。
Creation Date:
2024
Language:
English;French;Japanese
Source:
esp@cenet
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