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Surface treatment device of PVD (Physical Vapor Deposition) carrier plate
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Title:
Surface treatment device of PVD (Physical Vapor Deposition) carrier plate
Author:
ZHAO CHUANSHAN
Subjects:
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
;
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
;
CHEMICAL SURFACE TREATMENT
;
CHEMISTRY
;
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
;
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
;
COATING MATERIAL WITH METALLIC MATERIAL
;
COATING METALLIC MATERIAL
;
DIFFUSION TREATMENT OF METALLIC MATERIAL
;
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
;
METALLURGY
;
PERFORMING OPERATIONS
;
SPRAYING OR ATOMISING IN GENERAL
;
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
;
TRANSPORTING
Description:
The utility model relates to the technical field of PVD (Physical Vapor Deposition) processing, and provides a PVD carrier plate surface treatment device which comprises a conveyor belt, a dispensing unit and a sand blasting unit, the conveying belt is used for conveying the PVD carrier plate; the adhesive dispensing unit comprises an adhesive dispensing structure and a camera, the adhesive dispensing structure and the camera are located above the conveying belt, the adhesive dispensing structure can move relative to the conveying belt in the X direction, the Y direction and the Z direction, and the camera can obtain the position to be subjected to adhesive dispensing on the PVD carrier plate; and the sand blasting unit is positioned at a downstream station of the dispensing unit. According to the arrangement, the glue solution has certain fluidity and can comprehensively cover a protection area, the glue solution has certain buffering capacity and can resist impact of sand blasting, the glue dispensing unit
Creation Date:
2023
Language:
Chinese;English
Source:
esp@cenet
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