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Plug-in frame type heat dissipation case

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Title:
Plug-in frame type heat dissipation case
Author: WANG YE ; WEI LICHUAN
Subjects: CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS
Description: The invention provides a plug-in frame type heat dissipation case, and the case comprises a plug-in frame which is used for detachably fixing a board card, and the plug-in frame comprises a heat taking part which is used for carrying out the heat dissipation of the board card; the first heat dissipation piece comprises a first substrate and a first fin set connected to the first substrate, a substrate cavity is formed in the first substrate, and a fin cavity is formed in at least one first fin in the first fin set; wherein at least one of the two heat removal pieces is internally provided with a heat removal cavity, the substrate cavity is communicated with the heat removal cavity and the fin cavity, and the heat removal cavity, the substrate cavity and the fin cavity can contain and allow a phase change working medium to circulate. According to the plug-in frame type heat dissipation case, the heat removal area of the board card is increased by arranging the heat removal piece, the communication cavity is fo
Creation Date: 2023
Language: Chinese;English
Source: esp@cenet

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