Demonstration of Sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer
Materials Letters, 2017 [Peer Reviewed Journal]ISSN: 0167-577X ;EISSN: 1873-4979 ;DOI: 10.1016/j.matlet.2017.02.041
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