Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
Journal of electronic materials, 2024-03, Vol.53 (3), p.1192-1200 [Peer Reviewed Journal]The Author(s) 2023 ;ISSN: 0361-5235 ;EISSN: 1543-186X ;DOI: 10.1007/s11664-023-10853-5
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