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Mixed-sputter deposition of Ni-Ti-Cu shape memory films

Thin solid films, 1996-03, Vol.274 (1), p.101-105 [Peer Reviewed Journal]

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Title:
Mixed-sputter deposition of Ni-Ti-Cu shape memory films
Author: Krulevitch, P. ; Ramsey, P.B. ; Makowiecki, D.M. ; Lee, A.P. ; Northrup, M.A. ; Johnson, G.C.
Subjects: Alloys ; Applied sciences ; Cross-disciplinary physics: materials science; rheology ; Deposition by sputtering ; Exact sciences and technology ; Materials science ; Metals. Metallurgy ; Methods of deposition of films and coatings; film growth and epitaxy ; Physics ; Sputtering ; Stress ; Transmission electron microscopy
Is Part Of: Thin solid films, 1996-03, Vol.274 (1), p.101-105
Description: Ni-Ti-Cu shape memory films were mixed-sputter deposited from separate nickel, titanium, and copper targets, providing increased compositional flexibility. Shape memory characteristics, examined for films with 7 at.% Cu and 41–51 at.% Ti, were determined with temperature-controlled substrate-curvature measurements, and the microstructure was studied with transmission electron microscopy. The Ni-Ti-Cu films were found to have shape memory properties comparable with bulk materials, with transformation temperatures between 20 and 62 °C, a 10–13 °C hysteresis, and up to 330 MPa recoverable stress.
Publisher: Lausanne: Elsevier B.V
Language: English
Identifier: ISSN: 0040-6090
EISSN: 1879-2731
DOI: 10.1016/0040-6090(95)07072-9
CODEN: THSFAP
Source: Alma/SFX Local Collection

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