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Mixed-sputter deposition of Ni-Ti-Cu shape memory films
Thin solid films, 1996-03, Vol.274 (1), p.101-105
[Peer Reviewed Journal]
1996 ;1996 INIST-CNRS ;ISSN: 0040-6090 ;EISSN: 1879-2731 ;DOI: 10.1016/0040-6090(95)07072-9 ;CODEN: THSFAP
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Title:
Mixed-sputter deposition of Ni-Ti-Cu shape memory films
Author:
Krulevitch, P.
;
Ramsey, P.B.
;
Makowiecki, D.M.
;
Lee, A.P.
;
Northrup, M.A.
;
Johnson, G.C.
Subjects:
Alloys
;
Applied sciences
;
Cross-disciplinary physics: materials science
;
rheology
;
Deposition by sputtering
;
Exact sciences and technology
;
Materials science
;
Metals. Metallurgy
;
Methods of deposition of films and coatings
;
film growth and epitaxy
;
Physics
;
Sputtering
;
Stress
;
Transmission electron microscopy
Is Part Of:
Thin solid films, 1996-03, Vol.274 (1), p.101-105
Description:
Ni-Ti-Cu shape memory films were mixed-sputter deposited from separate nickel, titanium, and copper targets, providing increased compositional flexibility. Shape memory characteristics, examined for films with 7 at.% Cu and 41–51 at.% Ti, were determined with temperature-controlled substrate-curvature measurements, and the microstructure was studied with transmission electron microscopy. The Ni-Ti-Cu films were found to have shape memory properties comparable with bulk materials, with transformation temperatures between 20 and 62 °C, a 10–13 °C hysteresis, and up to 330 MPa recoverable stress.
Publisher:
Lausanne: Elsevier B.V
Language:
English
Identifier:
ISSN: 0040-6090
EISSN: 1879-2731
DOI: 10.1016/0040-6090(95)07072-9
CODEN: THSFAP
Source:
Alma/SFX Local Collection
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