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Three-dimensional profilometry for tool wear area using modulation-based structured illumination microscopy

Journal of physics. Conference series, 2024-05, Vol.2770 (1), p.012005 [Peer Reviewed Journal]

Published under licence by IOP Publishing Ltd. This work is published under https://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. ;ISSN: 1742-6588 ;EISSN: 1742-6596 ;DOI: 10.1088/1742-6596/2770/1/012005

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  • Title:
    Three-dimensional profilometry for tool wear area using modulation-based structured illumination microscopy
  • Author: Chang’an Hu ; Wang, Xi ; Xie, Zhongye ; Lv, Fei
  • Subjects: Computer vision ; Illumination ; Micromachining ; Microscopy ; Modulation ; Tool wear ; Wear mechanisms
  • Is Part Of: Journal of physics. Conference series, 2024-05, Vol.2770 (1), p.012005
  • Description: A new approach named modulation-based structured-illumination microscopy (MSIM) is presented in this paper to reconstruct the three-dimensional (3D) topography of the tooltip, which can be used to evaluate the degree of wear. In MSIM, the modulation estimation of the reflected patterns characterizes the surface profile. This technique can reconstruct the 3D profile precisely and something that conventional computer vision and imaging analysis cannot achieve. Importantly, an ordinary objective lens is used in the measurement system to take the image of the sample. So, the measurement system is simple and cheap. The theoretical analysis and experiments conducted on the tooltip are presented. The measurement repeatability can reach 500 nm. This method holds promise for applications in tool wear monitoring, wear mechanism analysis, and micromachining.
  • Publisher: Bristol: IOP Publishing
  • Language: English
  • Identifier: ISSN: 1742-6588
    EISSN: 1742-6596
    DOI: 10.1088/1742-6596/2770/1/012005
  • Source: Institute of Physics Open Access Journal Titles
    GFMER Free Medical Journals
    ProQuest Central
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