Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu-Cu Wafer on Wafer Thermocompression Bonding
IEEE Transactions on Electron Devices, 2017 [Peer Reviewed Journal]ISSN: 0018-9383 ;EISSN: 1557-9646 ;DOI: 10.1109/TED.2017.2653188
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